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This October 17-18, EDI CON USA 2018 brings its unique blend of engineering to the Santa Clara Convention Center. In this centrally located venue, engineers working in RF, microwave, signal integrity and power integrity will all come together to learn about new techniques and technologies as well as see the latest product innovations. This year’s two-day conference is packed with technical papers, workshops, panels, case studies, plenary keynote talks and the newly created EDI CON University, where attendees can earn IEEE CEU/PDHs for their attendance.
Advanced Thermal Solutions, Inc. (ATS), a thermal engineering and manufacturing company focused on the thermal management of electronics, announces the addition of tvLYT™ to its line of liquid crystal and surface thermography systems. Learn more.
Under the Syfer brand, the AEC-Q200 series of MLCC capacitors has had a range extension increasing the available working voltage from 2kV up to a maximum of 4kV. Designed for EV applications where ever higher voltages are needed, but where a margin for derating has to be accommodated for - ideal for power train use, like battery management and invertors.
By Samtec
This is a live demonstration of a combined Xilinx-Samtec 56 Gbps PAM 4 backplane system. The results achieved from this combined Xilinx/Samtec set-up proves the viability of 56G PAM4 signals in next-gen backplane applications found in data center equipment. Watch the demo to learn more.
Rohde & Schwarz demonstrates their new AdVISE visual inspection software for automated video inspection of EMC and other testing at IEEE EMC SIPI 2018. See additional videos from IEEE EMC SIPI here.
Visit our archived webinars page for educational resources on various design and measurement subjects and view at your convenience. Browse webinars here.
