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In high-speed circuit designs, power integrity (PI) and electromagnetic interference (EMI) are connected together. When the edge of the cavity created by power (PWR) and ground (GND) planes in PCBs radiates, the peak frequencies in the emissions are the same as the peak frequencies in the cavity self-impedance.
Executive Q&A with Ken Willis, Product Engineering Architect at Cadence discussing product development, business challenges, and the latest developments in SI/PI design. Discover more.
Rohde & Schwarz provides an automotive Ethernet testing solution to the University of New Hampshire InterOperability Laboratory (UNH-IOL). From now on, OEMs, Tier1s, Tier2s, and System Integrators can submit their products for compliance test certification via UNH-IOL, the first OPEN Alliance accredited test lab providing test certification for automotive Ethernet.
Sponsored By Anritsu
For engineers wading into the waters of higher data rates and PAM4, this special issue of Signal Integrity Journal on PAM4/BER and related topics, sponsored by Anritsu, brings some of the most recent pieces on these topics into one collection. Download this free eBook to learn more.
Meeting EMI and EMC requirements is critical to bringing electronic products to market. Compliance testing requires expensive equipment and test time at a compliance laboratory. Failures found late impact project costs and launch schedule due to debugging and re-testing. This video shows how the R&S RTO oscilloscope can be used with a near field probe to find and fix EMI issues quickly and reliably during the development at the R&D lab thereby minimizing expensive re-testing and shortening time to market.
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