EDI CON CHINA organizers invite exhibitors to submit products introduced during 2019 for consideration as part of the third annual awards program.

EDI CON China 2020 taking place May 13-14, 2020 at the China National Convention Center (Beijing, China), is accepting nominations for the third annual EDI CON Product Innovation Awards. The awards recognize the best of the best products on display at the annual exhibition.

Related Resources

Z-zero Launches v2019.1 of Z-planner and Z-solver for PCB Stackup Design
Ansys Launches HFSS Mesh Fusion, Redefines Product Development by Enabling Design of Entire Systems
Rosenberger Provides Connectivity Solutions for Industrial Applications
Open Eye MSA

EDI CON CHINA brings together speakers, exhibitors, and engineers who are focused on high-frequency analog and high-speed digital designs. The EDI CON Product Innovation Awards honor those products introduced in the last year that have had the greatest impact on the industry, providing the tools necessary to bring on the next generation of electronic design innovations.

Nominations are free and open to all EDI CON CHINA 2020 exhibitors. Finalists will be announced in advance of the event and will be awarded with signage to display in their booth. Winners will be announced before the keynote address on the Main Stage on May 12, 2020 at the China National Convention Center in Beijing, China.

Products must have been released to the market between January 1, 2019 and December 31, 2019. A panel of Microwave Journal and Signal Integrity Journal editors and EDI CON advisory board members will select up to 15 finalists, 3 in each category. The finalists will be featured in articles on Microwave Journal, Microwave Journal China, and Signal Integrity Journal online and will receive signs for display in their booths at EDI CON CHINA 2020. Entries are judged on exceptional innovation, including consideration of product functionality, ease of use, cost effectiveness, and other factors.

Categories:

  • Test & Measurement
  • Software/EDA
  • Semiconductors
  • Components, Cables, & Connectors
  • Materials, PCBs and Packaging

Nominations are accepted through February 28, 2020 and are open to all EDI CON CHINA 2020 exhibitors. Submission information located here: http://bit.ly/AwardEDICON

Engineers interested in speaking at EDI CON China can submit a detailed abstract for consideration  as part of the technical program by January 6th. 

More information, including instructions on how to submit an abstract and an application to exhibit, is available at www.ediconchina.com.