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It turns out that dielectrics, in fact, cool traces more efficiently than does convection + radiation, and therefore internal traces are relatively cooler. In this article, Brooks & Adam examine the question: Is there a predictable relationship between the external temperature of a trace and the internal temperature of the same trace carrying the same current?
Anritsu Company introduces PCIe Gen5 (PCIe 5.0) link training and Tx/Rx LEQ test automation software for its Signal Quality Analyzer-R MP1900A series BERT that creates the industry’s first measurement solution supporting the PCIe 3.0, 4.0 and 5.0 standards.
Viavi Solutions Inc., announced a range of products and services engineered to simplify and accelerate high-speed network test across all phases of the production lifecycle from product design, validation, and manufacturing, to fiber optic monitoring, and inspection.
A key challenge for embedded devices with DDR memories is to maintain signal integrity in the presence of power and ground rail fluctuations. This becomes even more important as supply voltages decrease and switching speed increases leading to tighter power rail tolerances and jitter requirements. Downlaod the white paper.
GaN offers many advantages compared to silicon MOSFETS, including smaller size, lower on state resistance, more stable gate voltage, much lower capacitance resulting in higher speed, lower inductance connection inductance and manufacturable using existing silicon wafer fabs and the promise of lower cost. With all of these benefits, mass adoption should be instantaneous, right? Yet, engineers are slow to change, in part due to a lack of credible information and in part due to fear of the unknown. In this webinar, Steve Sandler will answer important questions and provide the essential information you need and allay your fears. View the on-demand presentation to discover more.
Visit our archived webinars page for educational resources on various design and measurement subjects and view at your convenience. Browse webinars here.
DesignCon is north America's largest chip, board, and systems event that brings together the brightest minds across the high-speed communications and semiconductor industries who are looking to engineer the technology of tomorrow. Check out these product overviews and demonstrations recorded at DesignCon 2020 by Rohde & Schwarz and Keysight.
