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SIJ January 2025 Issue: How to Simulate Low Voltage, High Power 2000 Amps to a Dynamic Digital Load
Download this issue of Signal Integrity Journal featuring articles from industry experts including:
• “The Need for Speed and the Cost in Power,” Eric Bogatin, Signal Integrity Journal
• “How to Simulate Low Voltage, High Power 2000 Amps to a Dynamic Digital Load,” Heidi Barnes, Keysight Technologies; Steve Sandler, Picotest; and Benjamin Dannan, Signal Edge Solutions
• “Reflections on the Origins of COM,” Rich Mellitz, Samtec
• “Ultrafast Impedance Measurement of Active Ultra-High Current PDNs,” Steve Sandler, Picotest
• “How Interconnects Work: Crosstalk Quantification,” Yuriy Shlepnev, Simberian Inc
• “Analysis of Skew,” Gustavo Blando and Prashant Pappu, Amazon Web Services
• “A Subtle Problem to Avoid in Your Next Design,” Eric Bogatin, Signal Integrity Journal, and Dheeraj Gooty, University of Colorado Boulder
• “Created by Engineers, for Engineers: DesignCon Celebrates 30 Years,” Suzanne Deffree, DesignCon
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SIJ 2024 Issue: The Road from 1 Gbps-NRZ to 224 Gbps-PAM4
Download this issue of Signal Integrity Journal featuring articles from industry experts including:
• “Generative AI is in Your Future,” Eric Bogatin, Signal Integrity Journal
• “The Road from 1 Gbps-NRZ to 224 Gbps-PAM4,” Augusto (Gus) Panella, Molex
• “IEEE802.3dj Work on 200 Gbps per Lane and How Different FEC Options Affect SI,” Cathy Ye Liu, Broadcom
• “PCB Laminate Anisotropy: The Impact on Advanced Via Modeling,” Bert Simonovich, Lamsim Enterprises
• “Introducing an Upcoming IEEE Packaging Benchmark,” Istvan Novak and Gustavo Blando, Samtec; Shirin Farrahi, Kristoffer Skytte, and John Phillips, Cadence; Abe Hartman, Oracle; Ethan Koether, Amazon; and Mario Rotigni, STMicroelectronics
• “Assessing the Accuracy of EM Simulation Tools,” Aakriti Srivastava, Micron; Eric Bogatin, Melinda Piket-May, Mohammed Hadi, and Aditya Rao, Univ. of CO
• “Who Put that Inductor in My Capacitor?,” Will McCaffrey, Tyler Huddleston, Benjamin Dannan, and James Kuszewski, Northrop Grumman Mission Systems
• “Worst-Case Bit-Pattern Generator for Eye Diagram Analysis of Non-LTI High-Speed Channels,” Majid Ahadi Dolatsara, Keysight Technologies
• “DesignCon Returns to Celebrate Engineers and Innovation,” Suzanne Deffree, DesignCon
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SIJ 2023 Issue, "How Interconnects Work: Characteristic Impedance and Reflections"
Download this issue of Signal Integrity Journal featuring articles from industry experts including:
• “A National Security Crisis the Industry Can Address,” Eric Bogatin
• “How Interconnects Work: Characteristic Impedance and Reflections,” Yuriy Shlepnev
• “Ultra-Fine Line Differential Pair Design with No Return Plane,” Chaithra Suresh, Eric Bogatin, Melinda Piket-May, Paul Dennig, and Haris Basit
• “Understanding Via Impedance,” Donald Telian
• “The Case for Split Ground Planes,” Eric Bogatin
• “Avoiding GIGO with Field Solvers,” Bert Simonovich
• “Selecting a Backplane: PCB vs Cable Backplane for High-Speed Designs,” Andrew Josephson, Brandon Gore, and Jonathan Sprigler
• “Power Integrity Testing Requirements Introduce Extreme Interconnect Measures,” Steven Sandler
• “DesignCon Returns to January with New Offerings,” Suzanne Deffree
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SIJ 2022 Issue, "224 Gbps Link Systems: Modulation vs. Channel vs. FEC"
Download this issue of Signal Integrity Journal featuring articles from industry experts including:
• "The Reports of Copper’s Death May Be Exaggerated,” Eric Bogatin
• “224 Gbps Link Systems: Modulation vs. Channel vs. FEC,” Mike Li, Hsinho Wu, Masashi Shimanouchi et al
• “High Bandwidth Connectors: Sorting Out What Matters,” Janine Love
• “Measuring High Output Voltage Regulator Noise,” Masashi Nogawa and Steve Sandler
• “Beware of the Skew Budget: How Fiber Weave Effect Can Affect Your High-Speed Design,” Bert Simonovich
• “What to Expect in a Multi-Drop Bus,” Saish Sawant and Tim Wang-Lee
• “Welcome Home: DesignCon Returns to Santa Clara, Calif., in April,” Suzanne Deffree
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SIJ 2021 Issue, "Low-Cost and Free Tools Fit For an Engineer's Personal Budget"
Download this issue of Signal Integrity Journal featuring articles from industry experts including:
• "Attention All Tools Vendors, Listen Up!,” Eric Bogatin
• “224 Gbps Link Systems: Modulation vs. Channel vs. FEC,” Mike Li, Hsinho Wu, Masashi Shimanouchi et al
• “High Bandwidth Connectors: Sorting Out What Matters,” Janine Love
• “Measuring High Output Voltage Regulator Noise,” Masashi Nogawa and Steve Sandler
• “Beware of the Skew Budget: How Fiber Weave Effect Can Affect Your High-Speed Design,” Bert Simonovich
• “What to Expect in a Multi-Drop Bus,” Saish Sawant and Tim Wang-Lee
• “Welcome Home: DesignCon Returns to Santa Clara, Calif., in April,” Suzanne Deffree
SIJ July 2020 Issue, "The Truth About High-Speed Connector Design"
Download this issue of Signal Integrity Journal featuring articles from industry experts including:
• Eric Bogatin, Technical Editor, Signal Integrity Journal
• Davi Correia, Cadence Design Systems
• Scott McMorrow and Matt Burns, Samtec, Inc.
• Bert Simonovich, Lamsim Enterprises
• Kenneth Wyatt, Wyatt Technical Services LLC
• Cathy Liu, Broadcom
SIJ July 2020 Issue, "The Myth of Three Capacitor Values"
Download this issue of Signal Integrity Journal featuring articles from industry experts including:
• Eric Bogatin (Teledyne LeCroy); Larry Smith (Micron); Steve Sandler (Picotest)
• Istvan Novak (Samtec)
• Alex Manukovsky (Intel Corporation); Yuriy Shlepnev (Simberian Inc.)
• Steven Sandler (Picotest)
• Eric Brock and Mike Steinberger (MathWorks)
• Stephen Slater (Keysight Technologies)
• Janine Love (Editor, Signal Integrity Journal)
• Eric Bogatin (Technical Editor, Signal Integrity Journal)
SIJ July 2019 Issue, "Why Are There So Many Standards?"
Download this issue of Signal Integrity Journal featuring articles from industry experts including:
• Jay Diepenbrock (SIRF Consultants, LLC)
• Sanjeev Gupta (Intel Corp)
• Bill Hargin (Z-zero) & Don DeGroot (CCN)
• Al Horn (Rogers Corp)
• Bert Simonovich (LAMSIM Enterprises Inc.)
• Gary Giust (SiTime)
• Istvan Novak (Samtec)
• Steve Sandler (Picotest)
• Ken Wyatt (Wyatt Technical Services LLC)
SIJ January 2019 Issue, "Power Integrity Challenges"
Download this issue of Signal Integrity Journal featuring articles from industry experts including:
• Eric Bogatin (SIJ Technical Editor)
• Larry Smith (PDNpowerintegrity.com)
• Steve Sandler (Picotest)
• Bert Simonovich (LAMSIM Enterprises Inc.)
• Mike Violette (Washington Laboratories and American Certification Body)
• HeeSoo Lee (Keysight Technologies)
• Nathan Hirsch (Monsoon Solutions Inc.)
• Orlando Bell (GigaTest Labs)
• Marko Marin (Infinera)
• Yuriy Shlepnev (Simberian Inc.)
• Antonio Ciccomancini Scogna (Huawei)
• Davi Correia (Carlisle Interconnect Technologies)
Signal Integrity Journal Publishes First Print Issue
This debut print issue of Signal Integrity Journal™featuring articles from industry experts including:
• Eric Bogatin (SIJ Technical Editor)
• Steve Sandler (Picotest)
• Al Neves (Wild River Technology)
• Bert Simonovich (Lamsim Enterprises)
• Istvan Novak (Oracle)
• John Coonrod (Rogers Corp)