Signal Integrity Journal, covering signal integrity, power integrity and EMC/EMI, has published its 2024 issue. The magazine is available in print (by subscription and at select SI/PI/EMI events) and is also available as a technical eBook.
Subscribe to download the latest issue of Signal Integrity Journal featuring articles from industry experts including:
- “Generative AI is in Your Future,” Eric Bogatin, Signal Integrity Journal
- “The Road from 1 Gbps-NRZ to 224 Gbps-PAM4,” Augusto (Gus) Panella, Molex
- “IEEE802.3dj Work on 200 Gbps per Lane and How Different FEC Options Affect SI,” Cathy Ye Liu, Broadcom
- “PCB Laminate Anisotropy: The Impact on Advanced Via Modeling,” Bert Simonovich, Lamsim Enterprises
- “Introducing an Upcoming IEEE Packaging Benchmark,” Istvan Novak and Gustavo Blando, Samtec; Shirin Farrahi, Kristoffer Skytte, and John Phillips, Cadence; Abe Hartman, Oracle; Ethan Koether, Amazon; and Mario Rotigni, STMicroelectronics
- “Assessing the Accuracy of EM Simulation Tools,” Aakriti Srivastava, Micron; Eric Bogatin, Melinda Piket-May, Mohammed Hadi, and Aditya Rao, Univ. of CO
- “Who Put that Inductor in My Capacitor?,” Will McCaffrey, Tyler Huddleston, Benjamin Dannan, and James Kuszewski, Northrop Grumman Mission Systems
- “Worst-Case Bit-Pattern Generator for Eye Diagram Analysis of Non-LTI High-Speed Channels,” Majid Ahadi Dolatsara, Keysight Technologies
- “DesignCon Returns to Celebrate Engineers and Innovation,” Suzanne Deffree, DesignCon
Please note: By downloading this technical eBook, the details of your profile will be shared with the sponsoring advertisers (noted in the ad index ) and you may be contacted by them directly