Signal Integrity (SI) and Electromagnetic Compatibility (EMC) have traditionally been thought of as separate fields of engineering. However, as the speed of high speed interfaces increase, many of the parameters of interest have become increasingly common to both fields. This talk will discuss some of those parameters and how problems in one field can bleed over into the other and cause problems there. They include impedance discontinuities, rise/fall time, skew, crosstalk, plane splits, return paths, and cable shield termination.