HyperLynx® Fast 3D Solver enables efficient, full package model creation with multi-processing for faster turnaround time. It is ideally suited for power integrity, low-frequency SSN/SSO, and complete-system SPICE model generation while accounting for skin effect impact on resistance and inductance.
For additional information:https://www.mentor.com/pcb/hyperlynx/fast-3d-solver/?cmpid=12075