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This paper notes in detailed examples that with today’s high-speed designs, we can no longer restrict our thinking in terms of signal integrity, power integrity or EMC alone. We must consider all three disciplines and become educated about each of them to achieve successful designs.
Analog Devices, Inc. announced the Power by Linear™ LTC7821, an industry first hybrid step-down synchronous controller that merges a switched capacitor circuit with a synchronous step-down controller, enabling up to a 50% reduction in DC/DC converter solution size compared to traditional step-down solutions.
Keysight Technologies, Inc. announced the third generation of its P9000 series massively parallel parametric test system. The system accelerates the fast ramp of new technology and reduces the cost-of-test in the development and manufacturing of advanced semiconductor logic and memory ICs.
I’ve been attending and presenting at DesignCon for 28 years since the first HP High Speed Digital Symposium. And every year, it’s been the same thing, overloaded with too many great talks, too many companies’ latest products to see and too many online friends to finally meet in person. Check out Eric Bogatin's naïve DesignCon wish list.
This presentation will review the thermal effects of your PCB designs and demonstrate the performance changes due to the temperature change based on a practical case study. Learn more.
So you're designing SerDes links running between 5 and 25 Gbps? What do you need to look at to make sure that your board will work the first time, and meet your performance goals? It depends on the protocol, and can involve time-domain metrics such as eye masks or frequency-domain metrics such as insertion loss. Attendees will learn requirements for simulating popular SerDes protocols and new analysis methods.
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