Samtec featured man products including NovaRay,™ an industry-leading high bandwidth, high-density interconnect system. The pin-to-ground differential pair configuration enables very low crosstalk to 40 GHz+, tight impedance control, and minimal variance in data rate as stack heights increase. The system is 112 PAM4 capable and is rated up to 56 Gbps NRZ per channel. They also showed AcceleRate® HD, a .635 mm pitch, multi-row interconnect system that provides an ultra-high density interface and next generation bandwidth. The ADM6, ADF6 series has up to 240 total I/Os in 1.88” square inches (12.1 square cm) of PCB real estate. This is possible because the interconnect’s four rows of pins, on .635 mm pitch, available in up to 60 pins per row, with a slim 5 mm wide insulator footprint. The mated stack height is a low 5 mm, with 7 mm and 10 mm stack heights to follow. Also their AcceleRate® cable assembly that is the slimmest in the industry with a 7.6 mm body width ideal for closer proximity to the IC. The high-density 2-row design features 8 and 16 pair configurations on a 0.635 mm pitch for up to 92 pairs per square inch. Another product is the FQSFP-DD that is the first product to take the flyover architecture concept to the QSFP-DD form factor. The QSFP-DD form factor focuses on a next generation high-density, high-speed pluggable backwards compatible module form factor. ExaMAX® Direct Mate Orthogonal solutions remove the mid-plane, which allows fabric cards and line cards to mate directly and ultimately giving system designers increased flexibility. This architecture increases airflow and improves thermal efficiencies throughout the chassis. It also improves signal integrity, with shorter trace lengths and fewer connector transitions. XCede® HD achieves significant space savings and flexibility on the backplane with a small form factor and modular design. A 1.80 mm pitch and up to 84 differential pairs per linear inch provide greater density than traditional backplane systems. And finally, they also displayed FireFly™ - Designed for interchangeability, FireFly copper and optical both use the same micro connector system with easy insertion/removal and trace routing.

Signal Integrity Software presented two complementary sessions focused on building IBIS-AMI models and how DDR5 AMI models can be applied to systems design.  The sessions were titled “Building AMI Models for DDR5 Applications” and “Applying IBIS-AMI Techniques to DDR5 Analysis”.  There are multiple ways to analyze DDR interfaces for signal integrity and timing, and the preferred methodology will vary based on the controller being used. The industry is still experimenting with the feature set for DDR5 AMI models. SiSoft was happy about combining SiSoft’s Quantum-SI and its configurable analysis methodology with MathWorks’ Simulink for AMI model development. They have created a flow where DDR5 silicon vendors can adjust their AMI models and system-level analysis methodology in real time to suit changing needs.”

Soutwest Microwave was highlighting their 1.85mm, DC to 67 GHz PCB compression mount connector. It has the following features: 67 GHz of BW, optimal quality for SI, works with microstrip or GCPW, no soldering required, and is reusable.  Launch design assistance is available from the company.

SV Micro (Amphenol) was featuring their Mini-D RF Connection System featuring high density design (.110” port-to-port spacing), proven SMPS interface, solder-On PCB edge mount and surface mount connector options available and high frequency RF performance to 67 GHz (1.85mm). Applications include automated test equipment (ATE), bench-top testing, product evaluation boards, test and instrumentation, military and aerospace and embedded systems.

TE Connectivity demonstrated 112Gbps over a chip to module (IO) channel and over a backplane channel (using a Credo chip).  The IO channel demonstration used TE’s OSFP IO connector with Credo’s 16nm, lower power, high performance 112G PAM4 SerDes technology to exhibit operation over a 10-inch printed circuit board (PCB) channel.  The demo showed bit error rate (BER) performance of better than 1e-7.  The OSFP IO connector is a state-of-the-art 8 channel IO connector currently adopted for 400Gbps applications. The demonstration establishes TE’s OSFP connector performance as an 800Gbps-capable IO solution. The backplane demonstration used TE’s latest STRADA Whisper orthogonal backplane connector operating with a total channel loss of 20 dB at 28 GHz in a PCB-based direct plug orthogonal (DPO) architecture. Driven by Credo’s 112G PAM4 SerDes, the demo showed BER performance levels that enable the adoption of STRADA Whisper solutions for the next wave of networking equipment.

TE also showcased OSFP and QSFP-DD connectivity products that will soon enable 400-Gigabit Ethernet in a range of data center devices. The QSFP form factor is today's industry workhorse for delivering 40 and 100GbE. TE’s QSFP-DD connector adopts the basic concept as its predecessor, but doubles the electrical contact density, via eight differential pairs capable of 50 Gbps each, to achieve 400GbE while allowing existing QSFP modules to be plugged into the same cage.  The OSFP form factor is designed for maximum thermal and electrical performance, but does not provide backwards compatibility to existing form factors without an adapter so customers can choose the one that fits their needs best.

TDK Lambda was displaying their GENESYS 1U Full-Rack (GenPLUS-1U) series of 5000 W DC Programmable Power Supplies provides advanced features and functions in high power density (up to 5200W) and light weight (< 16.5lbs) with a comprehensive set of user-friendly interfaces. This series offers low-noise performance with Output voltages from 10 V (0-500 A) to 600 V (0-8.5 A) in both a three-phase 208 VAC Input (170-265 VAC, 47-63 Hz) and a wide-range three-phase 480 VAC Input (342-525 VAC, 47-63 Hz), both with Active Power Factor Correction (0.94 typical @ rated load).

Tektronix introduced EMCVu as a new all-in-one solution for EMI/EMC pre-compliance testing and troubleshooting. The system provides an accurate, convenient and cost-effective approach to determine if product designs will pass EMC emission compliance testing on the first try. At the core of the new solution are the Tektronix real-time USB spectrum analyzers that offer the performance of traditional desktop instruments at a fraction of the cost. Powered through the USB connection, the small size of Tektronix' real-time USB spectrum analyzers makes it easy to perform EMI/EMC testing outside the lab environment in relatively low-noise environments, such as basements or parking garages.The instruments are controlled by SignalVu-PC software running on a laptop or tablet. In their booth, they had demo stations for predictive machine learning empowered by real-time oscilloscopes; PCIe and SAS test, analysis and debug on protocol-aware BERTScope; and high bandwidth optical real-time analysis.

Teledyne LeCroy showed off their PCI Express 4.0 (PCIe Gen4) test solution that integrates its LabMaster 10Zi-A oscilloscope with the Anritsu Signal Quality Analyzer (SQA) MP1900A BERT including: New QPHY-PCIE4-TX-RX compliance test software automatically performs electrical and link equalization tests on PCI Express Gen4 transmitters and receivers; Updates to Teledyne LeCroy’s PCIEbus D PCI Express link-layer decode software option support the 16 Gb/s data rates utilized in PCI Express 4.0; Updates to Teledyne LeCroy’s unique ProtoSync software option enable PCI Express 4.0 signals acquired on the oscilloscope to be analyzed with Teledyne LeCroy’s industry-standard transaction-layer protocol analysis software, for the most accurate link equalization testing and the deepest insight into protocol issues; A new TF-PCIE4-CTRL controller enables complete automated fixture and DUT control for the fastest compliance testing; And updates to QPHY-PCIE3-TX-RX PCI Express 3.0 automated compliance test software now support the use of the Anritsu SQA MP1900A for all receiver and link equalization tests. This comprehensive system provides high-speed IC, device, and network engineers with one complete solution to conduct automated transmitter and receiver compliance tests, as well as link equalization verification. The Anritsu/Teledyne LeCroy solution can be easily expanded to 32 Gb/s, to address upcoming PCI Express 5.0 (PCIe Gen5) requirements. They also announced the availability of new PCI Express PCIe 4.0 Multi-Lead (solder down) and MidBus Probes for its Summit™ PCI Express 4.0 Protocol Analyzers. Both the PCIe Multi-Lead and MidBus probes, when used with a PCIe 4.0 Protocol Analyzer, enable testing at up to x16 link widths at 16 GT/s speeds using Teledyne LeCroy’s latest T.A.P4 technology.

Teledyne LeCroy also announced that the Voyager M310P USB 3.1 Analyzer/Exerciser system is approved for Compliance Testing of USB Power Delivery 2.0 (PD) by the USB Implementers Forum (USB-IF). With comprehensive support for USB PD 2.0, the compliance option allows developers to verify functionality, error recovery, and conformance for USB Power Delivery 2.0 in chipsets and end-products.