Articles Tagged with ''interconnect''

Sivers Semiconductors AB is in advanced discussions with its strategic customer, Ayar Labs, to partner on the next phase of engagement focused on manufacturing at scale to support deployment of Ayar labs in-package optical interconnect solutions.

Samtec, Inc. will be demonstrating next-gen, high-performance optical and copper interconnect solutions at the upcoming OFC 2024 Exhibition, the premier global event for optical communications and networking.

Rosenberger has announced the launch of its SMPS interconnect series for 224 Gbps/lane applications first designed by MultiLane.

Electromagnetic simulation tools will almost always give a result for any problem after pressing the run button. But is the result accurate? A methodology is introduced to establish the best practices for using the Ansys 2D Extractor and HFSS tools that include recommendations for the setup conditions, balancing accuracy, and computation time. With this methodology, an error in the absolute accuracy when solving for some electrical features can be achieved to better than 0.3%.

The new QCA platform will play a critical role in scaling interconnect technologies to high-volume manufacturing for AI, HPC, and Cloud applications.

In this article, Yuriy Shlepnev provides an overview of Simbeor electromagnetic signal integrity software and highlights its new features.

Samtec, Inc. is shipping the Optical FireFly Micro Flyover System, the first interconnect system with the flexibility to use micro-footprint high-performance optical and copper interconnects interchangeably.

In this article, Donald Telian explains why discontinuities do not sum the same way as loss. Telian outlines that a failing an RL mask might indicate that Tx or Rx are simply too close to a discontinuity, causing the discontinuity proximity effect. Read on to learn more about how to to distance SerDes from discontinuities.

Eric Bogatin takes a closer look at the potential consequences of the widening gap between industry demand and the supply of engineers with signal integrity design skills, and poses potential solutions to inspire future generations of signal integrity engineers.

At this year's productronica in Munich, ODU will be on site with the company’s ODU-MAC® Black-Line modular mass interconnect solution.