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Infineon expands its XDP digital protection product family with the XDP711-001, a 48 V wide input voltage range digital hot swap controller with a programmable safe operating area control designed for high-power AI servers.
The comprehensive BBU roadmap includes power solutions from 4 kW up to the world’s first 12 kW battery backup unit. The BBU solutions are designed to deliver highly efficient, reliable, and scalable power conversion in AI server racks.
Through enhanced system performance and with Infineon’s trademark robustness, the new OptiMOS TDM2454xx quad-phase power modules enable best-in-class power density and total-cost-of-ownership for AI data centers operators.
Qualcomm Technologies, Inc. announced the entry into an agreement to acquire Edge Impulse Inc., which will enhance its offering for developers and expand its leadership in AI capabilities to power AI-enabled products and services across IoT.
IDTechEx's report, "Chiplet Technology 2025-2035: Technology, Opportunities, Applications", unpacks the benefits and challenges of developing chiplet technology compared with competing semiconductor designs and their best-suited applications.
In its new power electronics report, "Status of the Power Module Packaging Industry," the Yole Group explores how the power module packaging supply chain is continually being reshaped.
IDTechEx's market report on the topic, "Quantum Computing Market 2025-2045: Technology, Trends, Players, Forecasts," tracks the progress of tech giants, governments and startups alike in building a network of quantum computers.
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