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Indium Corporation’s leading technical experts are set to deliver and participate in a number of presentations and panel discussions throughout IPC APEX Expo, where topics will include sustainability, assembly processes, and EV electronics.
Foxconn Interconnect Technology showcased the demonstration of its 224 Gbps signal transmission through their OSFP 2x1 SMT connector Upper Port with a 1M Passive DAC at the DesignCon 2024 exhibition.
The informative virtual Rohde & Schwarz event will span two half days, offering design engineers the opportunity to attend application-oriented presentations delivered by oscilloscope experts.
Saelig Company, Inc. has introduced the Rigol DG800 Pro/DG900 Pro Function/Arbitrary Waveform Generators, which feature up to 625/1250MSa/s sampling and 2/16Mpts/ch memory depth with 16-bit precision
The Fraunhofer Institute for Photonic Microsystems and the Max Planck Institute of Microstructure Physics are working together on the project "CONDOR - Superconducting spintronic devices for cryogenic electronics."
Infineon Technologies AG introduces the new CoolSiC MOSFETs 2000 V in the TO-247PLUS-4-HCC package to meet designers' demand for increased power density without compromising the system's reliability, even under demanding high voltage and switching frequency conditions.