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Simberian to demonstrate Simbeor THz software with new features at DesignCon 2019

Simberian Inc. will participate in the DesignCon 2019 conference and exhibition, January 29th – 31st at the Santa Clara Convention Center. Simberian will be presenting Simbeor THz electromagnetic signal integrity software updated with distributed computing on Linux platform, Simbeor SDK module with API for design automation in C/C++ and Matlab, and with completely automated post-layout de-compositional electromagnetic analysis.


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ANSYS and Helic Sign Acquisition Agreement

Acquisition will complement ANSYS’ portfolio to enable next-generation products in 5G and artificial intelligence

ANSYS announced today that it has entered into a definitive agreement to acquire Helic, the industry-leading provider of electromagnetic crosstalk solutions for systems on chips (SoCs). By combining the Helix products with its own flagship electromagnetic and semiconductor solvers, ANSYS aims to provide a comprehensive solution for on-chip, 3D integrated circuit and chip-package-system electromagnetics and noise analysis. 


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EDI CON CHINA PREVIEW

EDI CON China 2019 Preview

EDI CON China 2019 announces a preview of the technical conference and opening of registration for this year’s conference and exhibition. The event returns to Beijing and the Chinese National Convention Center (CNCC) April 1-3.


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Rohde & Schwarz and Marvell Pioneer All Physical Layer Test Cases for 1000BASE-T1 Compliance

Test and measurement specialist Rohde & Schwarz and semiconductor manufacturer Marvell® have demonstrated all the 1000BASE-T1 compliance test cases for layer 1 (PHY). Using validated chipsets from Marvell and test equipment from Rohde & Schwarz, OEMs, Tier2, System Integrators and test houses can set up Automotive Ethernet networks that are fully compliant with 1000BASE-T1 specifications.


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