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TE Connectivity (TE) announced its new ChipConnect internal faceplate-to-processor (IFP) cable assemblies.

TangiTek, LLC has been awarded a National Science Foundation (NSF) Small Business Innovation Research (SBIR) grant for $224K to conduct research and development (R&D) work on Novel Three Dimensional Flocked Carbon Fiber Microwave Absorbers.

ITEQ Corporation, a Taiwan-based global leader in the development and manufacture of copper-clad laminates for printed circuit boards (PCBs), announced today the introduction of its next generation halogen-free low-loss product for ultrahigh-speed signal transmission.

Keysight’s electromagnetic and signal and power integrity experts will be available at the 2017 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity (EMC 2017) to discuss a range of topics.

EDI CON USA 2017 announces a new scholarship program for university students, where any student that attends can enter the drawing for a one of two $500 scholarships being given away by visiting the booths of major sponsors on September 12-13.

Amphenol Industrial Products Group now offers a versatile connection system that distributes high current DC power in a compact design.

Samtec proudly announces the release of the new 14 Gbps FireFly™ FMC Development Kit.

Analog Devices, Inc., which recently acquired Linear Technology Corporation, announces the LTC7150S, a 20 V, 20 A monolithic synchronous buck converter with differential V_OUT remote sensing.