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IPC's Validation Services Program has awarded an IPC J-STD-001 and IPC-A-610 Qualified Manufacturers Listing (QML), meeting Class 3 requirements, to Colonial Assembly and Design, LLC, a wholly owned subsidiary of Zentech Manufacturing. Following an initial audit by IPC, Colonial Assembly and Design, LLC joins Zentech as one of the less than 10 U.S. trusted sources and suppliers meeting the stringent requirements of the Qualified Manufacturing Listing based on two of IPC's foremost standards: IPC J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610, Acceptability of Electronic Assemblies.

Passive Plus Inc. introduces the 01005BB104 broadband 100nF multilayer ceramic capacitors. The 01005BB104 – the industry’s smallest 100nF broadband part characterized for RF performance — has a case measuring (mils) 16 x 8 x 8, and offers resonant-free RF coupling/DC blocking from 16 KHz (lower 3-dB frequency) to beyond 65 GHz with < 1 dB insertion loss and < -15 dB return loss on suitable substrates. The 01005BB104 is rated at a DC working voltage (WVDC) of 4 and is available in a nickel-tin termination.

Rambus Inc. announced it has signed a broad five-year patent license agreement with Winbond Electronics Corp., a worldwide leading supplier of specialty memory. This agreement covers the use of Rambus patented memory solutions, including server DIMM chipsets, for Winbond products through 2021.

Rogers Corp.'s Advanced Connectivity Solutions (ACS) will feature examples of its high-performance circuit and thermal management materials for the most demanding electronic designs and working environments at DesignCon 2017, January 31-February 2, 2017 (exhibition from February 1-2, 2017) in the Santa Clara Convention Center (Santa Clara, CA). DesignCon is a premiere event for electronic design engineers working on circuit and system levels.

Molex LLC and TE Connectivity (TE) will collaborate on the launch and promotion of select new connector and cable assembly products that enable the growing number of high-speed applications required as data centers evolve with hyperscale models and increased virtualization. The DSA will support today’s data speeds and up to 56 Gbps and beyond. The scope of the agreement includes next-generation connector products, and the DSA is intended to build on the successful history with standard second source agreements for products such as: zSFP+ interconnects, zQSFP+ interconnects, CDFP interconnects, microQSFP interconnects, and Nano-Pitch I/O interconnects.