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The power electronics supply chain has undergone a phase of rapid expansion in manufacturing capacity, particularly for SiC and silicon devices, as well as SiC wafers.
Anritsu Company enhances its Signal Quality Analyzer-R MP1900A to support the latest USB4 Version 2.0 (USB v2) communication standard of 80 Gbit/s data transmission speed.
The new device increases power efficiency and performance in consumer, commercial, and industrial applications, while extending battery life in portable electronics.
Fischer Connectors is expanding its platform capabilities to meet the most demanding connectivity requirements for high-speed data transfer using the USB 3.2 Gen 2 protocol up to 10 Gbit/s
Hanwha Defence Australia have chosen a Rohde & Schwarz designed and built EMC test solution announced at Land Forces today. This capability is part of Stage 2 of the H-ACE facility where HDA is building the LAND 8116 Phase 1 Huntsman vehicles and LAND 400 Phase 3 Redback Infantry Fighting Vehicles.
Conductivity, stretchability, cost, and durability are just some of the factors of consideration for manufacturers when selecting ink types and materials; IDTechEx’s latest report deep dives into the many combinations available.
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