Industry News - Articles - Page 207 | Signal Integrity Journal

Economical 9GHz Microwave/Gigabit Passive Test Probes

October 26, 2016

Saelig Company, Inc. announces the availability of PicoConnect™ 900 Series Microwave/Gigabit Passive Test Probes, providing cost-effective testing of broadband signals or data streams up to 9GHz or 18Gb/s, including USB 2 & 3, HDMI 1 & 2, Ethernet, PCIe, SATA and LVDS standards. Representing a price-performance breakthrough, these new high-performance test probes have less than 0.4pF tip capacitance and a ground-referred loading of 220 to 910 ohms.

Highly Integrated AFE for Power Quality Monitoring Saves Significant Design Time and Cost

October 21, 2016

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Analog Devices, Inc. (ADI) today introduced a highly integrated polyphase analog front end (AFE) with power quality analysis designed to help extend the health and life of industrial equipment while saving developers significant time and cost over custom solutions. Achieving extremely accurate, high-performance power quality monitoring typically requires customized development, which can be expensive and time-consuming.

Samtec Expands ExaMAX® High-Speed Backplane Connector System

October 21, 2016

Samtec Inc.

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Samtec announces the expansion of the ExaMAX® High-Speed Backplane Connector System optimized for high-density and high-speed performance. The scalable ExaMAX® system meets today’s data rates while providing a future-proof path for next generation architectures.

New Line of USB 2.0 and 3.0 Connectors Expands CUI’s Interconnect Portfolio

October 18, 2016

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CUI’s Components Group today announced an expansion to its existing portfolio of power, audio and signal connectors with the addition of a USB product line. The new connector family incorporates USB 2.0 and 3.0 connectors available in Type A, Type B, Micro AB, Micro B, Mini AB and Mini B USB versions. Able to support data rates up to 5 Gbps in USB 3.0 models, the new product family is ideal for a variety of I/O applications in consumer and portable electronic devices, including mobile computing equipment, digital audio devices and high volume storage products.

TE's new high speed cables offer signal integrity in IEEE 1394 applications

September 27, 2016

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TE Connectivity Ltd., a world leader in connectivity and sensors, announced that its new Raychem high-speed data transmission cables for IEEE 1394 applications. Designed for use with military ground, military and commercial aerospace and marine systems, the ruggedized cable helps block out excess noise in harsh environments to enable dependable signal integrity in extreme conditions.

Ardent Concepts Aims to Eliminate SMT Connectors with QUICKLINK Coaxial Connector

September 20, 2016

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Ardent Concepts, Inc. looks to upend the status quo by introducing a twist-to-lock compression mount connector that replaces cumbersome surface mount connectors that require a receptacle on the PCB. Ardent’s patented QUICKLINK^TM Connector mounts directly to the PCB with a twist-to-lock footprint design that requires only two small thru holes and a gold pad for the connector to land on. QUICKLINK footprints can be placed anywhere on your board to allow easy access to any channels from your device without having to solder on costly SMA or SMP surface mount receptacles.

Teledyne LeCroy Releases USB Type-C™ Compliance Suite

August 18, 2016

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Teledyne LeCroy, a worldwide leader in serial data test solutions has announced the release of the USB Type-C™ Compliance Suite for the Voyager M310C SuperSpeed USB 3.1 protocol verification platform. Based on USB-IF's USB Type-C Functional Verification Specification, this automated test suite allows developers to verify the logical USB Type-C port operation and verify compliance to the verification specification for devices utilizing the USB Type-C interface.