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DesignCon 2018, the conference for chip, board and systems design engineers, today announced three new keynote presentations covering NASA's New Horizons mission, the safety of autonomous vehicles and expert predictions of future challenges within engineering.

Teledyne LeCroy, and Spirent Communications, the global leaders in Ethernet and Fibre Channel test and measurement solutions, announced today the industry’s first Ethernet generation and test solution for developers of Pulse Amplitude Modulation (PAM4) networks.

Tektronix, Inc., a worldwide provider of measurement solutions, today announced the 5 Series MSO Low Profile oscilloscope for machine diagnostics and automated test (ATE) applications.

China Telecomand TransTeleCom (ТТК), have developed the first transit telecommunication route connecting China and Europe based on100G ULH (Ultra Long Haul) DWDM technology. As part of the project, the companies have constructed a new 100Gbps gateway interface on the border between the two countries, the Chinese city of Manzhouli and in the Russian city of Zabaikalsk.

Ardent Concepts, Inc., a designer and manufacturer of high performance GHz connectors used in the development of next generation semiconductor applications has released a new design of its 20, 40, & 70 GHz Straight Mount TR Multicoax series connector. 

Passive Plus, Inc. (PPI) is now offering the 0708N (.070” x .080”) series capacitor. These parts exhibit Low ESR/ESL, Low Noise, High Self-Resonance as well as ultra-stable performance over temperature. These capacitors are 100% RoHS compliant.

Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced the launch of its TimeProvider 4100, a highly flexible IEEE™ 1588 Precision Time Protocol (PTP) grandmaster clock designed to scale from the edge to the aggregation layers of both mobile infrastructure and access networks.

Samtec, a privately held $662MM global manufacturer of a broad line of electronic interconnect solutions, proudly announces the release of the two new VITA 57.4-compliant FMC+ Loopback Cards. These new solutions provide FPGA designers easy to use loopback options for testing low-speed and high-speed multi-gigabit transceivers on any FPGA development board or FPGA carrier card.

Polar Instruments - a specialist provider of tools for PCB design, fabrication and test – announces a major enhancement for Speedstack Si at Productronica.  Speedstack Si 2018 edition now contains an integrated insertion loss field solver – which lets the user both design and add comprehensive insertion loss graphs and stackup specification into Speedstack’s professional report engine.

Z-zero announced today the launch of two new software products —Z-planner, for PCB stackup design and materials selection; and Field Solver Sandbox, for quick, accurate impedance and insertion–loss results. Z-planner is a field-solver based PCB stackup planning and materials selection tool that’s optimized for hardware engineering teams that may or may not be familiar with the exhaustive details of the laminate and PCB-fabrication processes.