Industry News

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EDI CON USA Announces 2017 Conference Chairs

EDI CON USA 2017, an event that brings together engineers working on high-frequency analog and high-speed digital designs, will take place at the Hynes Convention Center, September 11-13 in Boston, Mass. The event management team is pleased to announce this year’s conference chairs: Thomas Cameron, CTO for the Communications Business Unit at Analog Devices Inc. will serve as the chair for the high-frequency subject areas, and Istvan Novak, senior principal engineer at Oracle, will serve as the chair for the high-speed digital areas of the conference.


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Signal Integrity Journal Launches With Seven Industry Leading Sponsors

Signal Integrity Journal, a new sister publication to Microwave Journal covering signal integrity, power integrity and EMC/EMI related topics, has secured seven sponsors to start the new year. The Platinum Level sponsorships are sold out for 2017 with industry leaders Rohde & Schwarz, Anritsu, Mentor Graphics and CST filling the top sponsorship level. Joining them are Cadence and Samtec at the Gold Level and Passives Plus at the Silver Level.


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Rogers Corp. to Exhibit Advanced Circuit and Thermal Management Materials at DesignCon 2017

Rogers Corp.'s Advanced Connectivity Solutions (ACS) will feature examples of its high-performance circuit and thermal management materials for the most demanding electronic designs and working environments at DesignCon 2017, January 31-February 2, 2017 (exhibition from February 1-2, 2017) in the Santa Clara Convention Center (Santa Clara, CA). DesignCon is a premiere event for electronic design engineers working on circuit and system levels.


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Robust Industrial Grade X2 Capacitors With a Rated Voltage of  350 V AC

TDK Corp. presents a new series of robust EPCOS MKP X2 capacitors for EMI suppression. Compared with conventional X2 capacitors designed for rated voltages of 305 V AC, these new components offer a higher rated voltage of 350 V AC. This makes them suitable for EMI suppression in input filters – specifically for applications on the North American market – and output filters of photovoltaic inverters.


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Molex and TE Connectivity Collaborate on Next-Gen Data Communications Electronic Products

Molex LLC and TE Connectivity (TE) will collaborate on the launch and promotion of select new connector and cable assembly products that enable the growing number of high-speed applications required as data centers evolve with hyperscale models and increased virtualization. The DSA will support today’s data speeds and up to 56 Gbps and beyond. The scope of the agreement includes next-generation connector products, and the DSA is intended to build on the successful history with standard second source agreements for products such as: zSFP+ interconnects, zQSFP+ interconnects, CDFP interconnects, microQSFP interconnects, and Nano-Pitch I/O interconnects.


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Anritsu Introduces Industry's First Test Automation Tool for RF and Optical Testing Needs

Anritsu Co. released a new version of its award-winning SkyBridge Tools™ Test Manager that supports OTDR measurements to establish the industry’s first comprehensive field test automation tool that supports both RF and optical testing. By reducing test time by as much as 90% and increasing accuracy more than 10 times, SkyBridge Tools dramatically simplifies network installation verification, allowing contractors to close out projects more efficiently, receive prompt payment, and start new projects faster.


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CEL Launches New Laser Diodes for 100G CWDM4 Data Center Applications

CEL introduces the availability of Renesas Electronics Corporation's new series of semiconductor Laser Diodes, the “NX6375AA Series” into North America. The newly developed direct modulation distributed feedback Laser Diodes support 25 Gbps × four wavelengths operation as the light sources in 100 Gbps optical transceivers that are used for communication between servers and routers installed in data centers.


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