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TE Connectivity, a world leader in connectivity and sensors, recently released its press-fit stacking connector, a 56-position VPX footprint-compatible connector designed for rugged, high speed applications. Press-fit stacking connectors satisfy the need for 10Gb/s digital signals in high density packaging.

Spectrum Instrumentation has expanded its line of PXIe-based (PXI Express) high-speed digitizers with nine new cards. The new M4x.22xx series includes modules that offer one, two or four fully synchronous channels. Each channel is equipped with its own analog-to-digital converter (ADC), with real-time signal sampling at rates from 1.25 GS/s to 5 GS/s, and scope-like signal conditioning circuitry that allows programming of parameters such as input gain, signal offset and coupling.

Bringing together engineers working in RF/microwave with those working in high-speed digital, EDI CON USA offers an opportunity to learn from other disciplines and transfer techniques and methods between applications. The exhibit floor will include booths from industry-leading companies working in both of these areas, as well as feature the SI ZONE, a specialized demo area for signal integrity, power integrity and EMI/EMC products. 

Targeting wireless infrastructure and other communications equipment, Integrated Device Technology (IDT) introduced four dual-channel fanout buffers for distributing high frequency clock and data signals. The 1.8 V LVDS buffers add very low phase jitter, typically less than 45 fs.

Microwave Journal visited electronica 2016, discovered Planet e and reports on the RF and microwave industry trends that were at the forefront of the world's leading trade fair for electronic components, systems and applications.

Siemens AG agreed to buy Mentor Graphics Corp. for $4.5 billion in its biggest acquisition since 2014 as the German engineering company extends its industrial software capability.

Teledyne LeCroy launched two new products ¾ the RP4030 active voltage rail probe and an industry first MIPI System Power Management Interface (SPMI) serial decoder. The RP4030 probe measures small signal variations on a DC power/voltage rail, while the SPMI decoder monitors and correlates SPMI serial bus messages with DC power/voltage rail changes. These two products are ideal for testing line or battery-powered computing and embedded systems that use digital power management ICs (PMICs) to reduce power consumption and increase system efficiency.

Analog Devices Inc. announced a new generation of high-precision successive-approximation (SAR) analog-to-digital converters (ADCs) that uniquely combine the attributes of high performance, low power, small footprint and ease of use. These ICs enable mobile test and measurement instruments to operate for longer duration during field tests while improving measurement accuracy and repeatability. The new devices also support development of smaller-sized instruments, which can be placed closer to the sensors being measured, or allow for an increased number of data acquisition channels in the same form factor.