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PPI has the 01005BB Broadband 100nF Ceramic Capacitors. The 01005BB104 – the smallest 100nF broadband part characterized for RF performance -- has a case measuring (mils) 16 x 8 x 8, and offers resonant-free RF coupling/DC blocking from 16 kHz (lower 3-dB frequency) to beyond 65 GHz with < 1 dB insertion loss and < -15 dB return loss on suitable substrates.

GL Communications Inc. announced today its insight into Testing High Density Multiport  1 Gigabit/ 10 Gigabit Ethernet Switches for Functionality, Throughput and related parameters using GL’s Integrated multi interface Rackmount (mTOP™) Test Platform and HD PacketExpert™ 10GX a versatile Ethernet based Testing Tool.

Designers of small, battery-powered electronics can enhance the user experience by extending battery life and further shrinking device size with six new low-power power-management integrated circuits (PMICs) from Maxim Integrated Products, Inc.

Keysight Technologies, Inc. today announced KeysightCare, a new service model that offers design and test engineers dedicated, proactive support for instruments, software, and solutions.

At this week’s IEEE IEDM 2018 conference, imec presents a first demonstration of 3D stacked FinFETs on 300mm wafers using a sequential integration approach with a 45nm fin pitch and 110nm poly pitch technology.

TE Connectivity (TE), introduces its new high density plus (HD+) card edge power connectors, which delivers the highest current density of any card edge power connectors. Capable of supporting power supplies up to 3kW, these connectors are designed to enable systems with increasing power requirements in next-generation data centers.

PLDA and Samtec, today announced a demo of their combined PCIe 4.0 solution that delivers full PCIe 4.0 bandwidth (16 GT/s) over copper or optical fiber at minimal cost.

Keyssa®, announced its Virtual Pipe I/O (VPIO) architecture that enables I/O to scale with processor/memory performance and allows product designers to develop new classes of products. 

EDI CON USA 2018 took place in Santa Clara Convention Center on October 17 and 18, and as part of its technical program, EDI CON USA presents its Outstanding Paper Awards.