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Analog Devices, Inc., which recently acquired Linear Technology Corporation, announces the LTM4651, a nonisolated inverting output µModule^® regulator that can generate –26.5V to –0.5V output from a positive input supply voltage. The LTM4651 operates over a 3.6V to 58V input voltage range and is housed in a 15mm x 9mm x 5.01mm BGA package, a compact solution, providing –5VOUT, –12VOUT, –15VOUT and –24VOUT from industrial standard 5VIN, 12VIN or 24VIN supplies.

Zuken USA, Inc, is again participating in PCB West, to be held September 12-14 in Santa Clara, CA. The event includes a three-day technical conference and one-day exhibition to be held at the Santa Clara Convention Center.

Zuken and Nano Dimension will share a booth and showcase the latest technologies for PCB Design for Manufacture (DfM) and 3D printing. Zuken’s CR-8000 Design Force DfM software provides a platform to automate the process of applying the necessary rules for different board technologies, including flex, with the benefit of improving design quality and manufacturing yields. This software incorporates a database of design rules for many different manufacturing processes that take into account materials and technologies.

MACOM Technology Solutions Inc. (“MACOM”) today announced the industry’s first complete 100G Single Lambda Solution that enables the cost structure with the supply-chain flexibility for mainstream Cloud Data Center deployment. Designed to help accelerate the deployment of 100G optical interconnects at Cloud-scale cost structures, MACOM’s 100G Single Lambda Solution enables customers to quickly and easily integrate high-performance MACOM components and get to market faster with the next generation of 100G optical modules.

Keysight Technologies, Inc. (NYSE: KEYS) today announced innovative enhancements for the M8040A high-performance bit error ratio tester (BERT) solution for testing PAM-4 and NRZ devices that operate up to 64 GBaud. Engineers in validation labs and R&D who characterize receivers on the physical layer for emerging 400G data center interconnects will benefit from simplified test setups and repeatable and accurate results.

ECT interposers are industry-proven solutions for connecting and disconnecting boards in a reliable and non-destructive way. Drawing from its extensive portfolio of spring probes, ECT manufactures interposers that fully meet the electrical requirements of a wide variety of applications.

Yole Développement (Yole) expects the IGBT market to go over US$ 5 billion by 2022 with a major growth coming from IGBT power module. The high performance that SiC and GaN materials can afford is already creating a battlefield with Silicon based IGBT. To overcome this thread, Si IGBT manufacturers need to look for prompt solutions as technologically update their systems for better efficiency or to increase their IGBT portfolio offer.

Teledyne LeCroy, Inc. and Anritsu Company U.S. announce today a partnership to provide the industry’s most capable PCI Express 4.0 (PCIe Gen4) test solution, integrating the Anritsu Signal Quality Analyzer (SQA) MP1900A BERT with the LabMaster 10Zi-A oscilloscope and QPHY-PCIe4-Tx-Rx software from Teledyne LeCroy. This comprehensive system provides high-speed IC, device, and network engineers with one complete solution to conduct automated transmitter and receiver compliance tests, as well as link equalization verification.

Samtec, a privately held $662MM global manufacturer of a broad line of electronic interconnect solutions, proudly announces the release of the Direct Connect™ Horizontal (DCH) High-Speed Press-Fit Twinax Cable Assembly. This new solution expands Samtec’s Direct Connect™ Cable Systems targeted for cost-effective, high-performance flyover or co-planar, right angle and parallel board-to-board applications.

Miniaturization and increasing power densities are major concerns for modern electronic applications. The lifetime of electronic applications can be dramatically reduced by the increase of the working temperatures by just a few degrees.Further, the insulation of the whole printed circuit board (PCB) from the environment in order to provide efficient protection against humidity and dust for certain applications turns heat dissipation an even more challenging task.