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The AXIe Consortium announced a new specification, Optical Data Interface, suitable for high-speed instrumentation systems addressing challenging applications in 5G communications, mil/aero, and advanced communication research. The AXIe Consortium was joined by Conduant Corporation, Guzik Technical Enterprises, Intel Corporation, Keysight Technologies, Samtec Incorporated, and Xilinx in endorsing the standard and stating their plans to offer components or instrumentation products compliant with the new standard.

Samtec, a privately held $662MM global manufacturer of a broad line of electronic interconnect solutions, proudly announces the expansion of the ExaMAX® High-Speed Backplane Connector System with new DMO options. System designers can now leverage the inherent advantages of direct mate orthogonal architectures when compared with traditional backplane systems.

The German Fraunhofer Heinrich Hertz Institute HHI and Silicon Valley Missing Link Electronics (MLE) collaborate to optimize 25G/50G Ethernet Low-Latency Media Access Controller (MAC) for Xilinx Ultrascale+ Transceiver Technology.

EDI CON China 2018, the conference that brings together engineers working on high-frequency analog and high-speed digital designs and takes place March 20-22, 2018 at the China National Convention Center in Beijing, announces the Call for Abstracts for its technical sessions is open.

Keysight will host a complementary seminar on crosstalk and jitter challenges, from simulation to test. Keysight technical experts MinJie Chong and Hee-Soo Lee will discuss and demonstrate the latest tools and techniques for solving these challenges. Lunch is provided.

Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces the CoolSiC™ Schottky diode 650 V G6. This latest development in the CoolSiC diode family is built upon the distinctive characteristics of the G5, providing reliability, quality, and increased efficiency. The CoolSiC G6 diodes are a perfect complement to the 600 V and 650 V CoolMOS™ 7 families.

Pickering Electronics, a long-established Reed Relay manufacturer, will showcase the world’s highest density Reed Relay at productronica 2017, on booth A1.452.

TE Connectivity (TE), a world leader in connectivity and sensors, today announced that its microQSFP pluggable connectors, cages and cable assemblies are gaining rapid traction in the industry as indicated by cloud server application design wins and significant ongoing data center switches, and wireless networking equipment design efforts. 

Silicon Labs (NASDAQ: SLAB) has introduced a new family of high-performance clock generators offering the industry’s most highly integrated timing solution for 10/25/100G applications. The new Si5332 clock family leverages Silicon Labs’ proven MultiSynth fractional clock synthesis technology to deliver a timing solution that provides best-in-class frequency flexibility and jitter performance of 230 fs rms.

Richardson RFPD, Inc. announced today the availability and full design support capabilities a new series of DC/DC converters rom RECOM Power, Inc. (RECOM).

The RxxPxxyyD Series devices feature 6400 VDC isolation and <10 pF isolation capacitance and have been designed to fulfill the demanding requirements of high slew-rate SiC transistor drivers.