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DesignCon previews announcements from more than 50 exhibitors participating at the event next week. DesignCon, the premier educational conference and technology exhibition for electronic design engineers in the high-speed communications and semiconductor communities, will present three days of deeply technical sessions, special events and a robust expo hall hosting the industry's leading solution providers. Via the expo hall, attendees will have the opportunity to experience emerging solutions first hand and connect with leading companies on what's to come.

Rohde & Schwarz has introduced the R&S RT-ZPR20, extremely low-noise power rail probe with a bandwidth of 2 GHz

Tektronix, a leading worldwide provider of measurement solutions, today introduced new equivalent time automated compliance test solutions for 4-lane 100G electrical interfaces defined in the IEEE 802.3bm and 802.3bj specifications. The new capabilities along with the full set of Tektronix solutions for 100G and 400G characterization and validation will be demonstrated February 1-2 at DesignCon 2017, Booth 741.

Anritsu Co., a DesignCon 2017 Diamond Sponsor, will present testing solutions and technical sessions to aid engineers more efficiently develop next-generation chips, boards and systems used in emerging applications, including IoT/M2M and 5G, at DesignCon, beginning January 31 in Santa Clara, CA. Signal integrity solutions featuring the award-winning Signal Quality Analyzer (SQA) MP1800A BERT, as well as the VectorStar® and ShockLine™ vector network analyzers (VNAs) will be on display in the Anritsu booth (#633) throughout the show.

Samtec, a privately held $662 million global manufacturer of a broad line of electronic interconnect solutions, proudly announces the expansion of their extensive line of standard and custom AccliMate™ Sealed Cable Plugs and Receptacles, including new crimp sealed bayonet latching circulars. These systems meet IP67/IP68 requirements for dustproof and waterproof sealing and are designed for industrial, outdoor, underwater and other harsh environments.

EDI CON USA 2017 announces that this year’s call for abstracts (CFA) is now open. The EDI CON USA Technical Advisory Committee, event management team, and this year’s conference chairs, Thomas Cameron, CTO for the Communications Business Unit at Analog Devices Inc. and Istvan Novak, Senior Principal Engineer at Oracle, worked in conjunction to develop the CFA. Potential speakers can submit abstracts in 12 tracks, vying for speaking slots in technical sessions at the conference as well as an EDI CON USA Outstanding Paper Award.

Knowles Capacitors is pleased to announce that their ongoing material development process has qualified an X8R dielectric material to be Lead (Pb) free. This is part of Knowles environmental commitment to continuously develop materials that are more environmentally friendly, as well as ensuring continued compliance to the existing requirements along with potential future changes to the EU RoHS directive.

Molex, a global provider of integrated electronic products, will showcase high-speed data connectivity solutions at DesignCon 2017 in Santa Clara, CA, February 1-2, 2017.  Molex booth 619 will feature next-generation technologies designed to meet rising data speeds and bandwidth in demanding networking and high performance computing applications.

Keysight Technologies Inc. announced it will exhibit its latest high-speed digital solutions at DesignCon 2017, Booth 725, Santa Clara Convention Center, Feb. 1-2. Keysight's technical experts and application engineers will demonstrate the most advanced design and test solutions, developed for solving today's most difficult high-speed digital measurement challenges. Keysight is proud to be the host sponsor of DesignCon 2017.