Industry News

Passive Plus Article 8.23

PASSIVE PLUS, INC. PRODUCT SPOTLIGHT: 0805N 1111N Series

Passive Plus, Inc. (PPI) offers a Low ESR/ESL EIA capacitor series. These multi-layer capacitors have been developed for High-Q and Microwave applications including base station products and L/C filters. The 0805N and 1111N series capacitors have high self-resonance frequencies (to 25 GHz), exhibit NP0 characteristics, and are 100% RoHS compliant.


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TEC STRADA

TE Connectivity Introduces Cabled STRADA Whisper Connectors

New Solution Delivers 25-50 Gbps Performance with Low Insertion Loss & High Flexibility

TE Connectivity (TE), a world leader in connectivity and sensors, today announced its cabled STRADA Whisper product line. Cabled STRADA Whisper connectors eliminate the need for printed circuit board (PCB) backplanes to achieve improved performance and flexibility as data speeds increase.


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Anaren Building

ANAREN ANNOUNCES NEW LINE OF RADIATION HARDENED ISOLATED DC-DC CONVERTERS FOR HARSH SPACE ENVIRONMENTS

Anaren, Inc. announced today that it has released a new radiation hardened, isolated DC-to-DC converter for the high reliability space market. The MSK7010RH is a series of 10W DC-to-DC converters that are radiation hardened by design to provide reduced sensitivity to space radiation including; total ionizing dose, single event effects and displacement damage. The use of magnetic isolation eliminates the risk associated with traditional opto-isolator feedback.


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Inverter DCDC Converter

2A, 2MHz, 60V Boost/SEPIC/Inverter DC/DC Converter with IQ = 9µA

Analog Devices, Inc., which recently acquired Linear Technology Corporation, announces the LT8362, a current mode, 2MHz step-up DC/DC converter with an internal 2A, 60V switch. It operates from an input voltage range of 2.8V to 60V, suitable for applications with input sources ranging from a single-cell Li-Ion battery to automotive and industrial inputs.


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Microsemi Product

Microsemi Awarded Contract to Accelerate Adoption of Silicon Carbide Technology as New Member of PowerAmerica

Company to Develop State-of-the-Art 1.7 kV and 3.3 kV SiC MOSFETS and Diodes as Part of PowerAmerica Institute’s $70 Million Backing From the U.S. Department of Energy Over Five Years

Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced it has become a member of PowerAmerica—a manufacturing institute comprised of public and private representatives from the semiconductor industry, the U.S. Department of Energy, national laboratories and academia—to accelerate the commercialization and adoption of wide band gap semiconductors.


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DeepMeasure

Waveform analysis and search feature helps to validate the characteristics and performance of complex devices

Pico Technology, market leader in PC oscilloscopes and data loggers, today introduced the DeepMeasure analysis tool. Included as standard with PicoScope 3000, 4000, 5000, and 6000 Series oscilloscopes, DeepMeasure delivers automatic measurement of waveform parameters on up to a million successive waveform cycles. Results can be easily sorted, analyzed and correlated with the waveform display.


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EDI CON USA 2017 Online Show Daily

September 11-13, Boston, Mass.

EDI CON USAWelcome to Microwave Journal's Online Show Daily, a sister publication to Signal Integrity Journal. View coverage of the Electronic Design Innovation Conference 2017 in Boston, Mass., September 11-13. Our coverage includes exclusive content from conference organizers, exhibitors, the latest product releases, social media, August show issue technical articles and analysis from our editors.


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EMC2017

EMC in the Capital

IEEE EMC SI/PI 2017 Summary

The 60th IEEE EMC SI/PI Symposium took place August 7-11 at National Harbor in Washington DC with the “plan to inspire, envision, and innovate.” The keynote set the stage for this plan as Julius Knapp, FCC Chief of the Office of Engineering and Technology, discussed the status of the FCC and industry EMC standards, the equipment authorization program and enforcement as the wireless space becomes more and more crowded with emerging technologies such as IoT, connected/autonomous vehicles, UAVs, increased satellite broadband and 5G taking off.


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IBIS

EDI CON USA Adds IBIS Summit to Its Premier Program Line-Up

IBIS Open Forum Calls for Participation and Presentations

EDI CON USA, the first industry event to bring together RF/microwave and high-speed digital design engineers and system integrators, announced that IBIS Open Forum will hold its first, formal IBIS Summit Meeting at EDI CON USA 2017 at the Hynes Convention Center, September 11-13 in Boston, Mass.


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