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EDI CON USA 2017 announces that this year’s call for abstracts (CFA) is now open. The EDI CON USA Technical Advisory Committee, event management team, and this year’s conference chairs, Thomas Cameron, CTO for the Communications Business Unit at Analog Devices Inc. and Istvan Novak, Senior Principal Engineer at Oracle, worked in conjunction to develop the CFA. Potential speakers can submit abstracts in 12 tracks, vying for speaking slots in technical sessions at the conference as well as an EDI CON USA Outstanding Paper Award.

Knowles Capacitors is pleased to announce that their ongoing material development process has qualified an X8R dielectric material to be Lead (Pb) free. This is part of Knowles environmental commitment to continuously develop materials that are more environmentally friendly, as well as ensuring continued compliance to the existing requirements along with potential future changes to the EU RoHS directive.

Molex, a global provider of integrated electronic products, will showcase high-speed data connectivity solutions at DesignCon 2017 in Santa Clara, CA, February 1-2, 2017.  Molex booth 619 will feature next-generation technologies designed to meet rising data speeds and bandwidth in demanding networking and high performance computing applications.

Keysight Technologies Inc. announced it will exhibit its latest high-speed digital solutions at DesignCon 2017, Booth 725, Santa Clara Convention Center, Feb. 1-2. Keysight's technical experts and application engineers will demonstrate the most advanced design and test solutions, developed for solving today's most difficult high-speed digital measurement challenges. Keysight is proud to be the host sponsor of DesignCon 2017.

EDI CON USA 2017, an event that brings together engineers working on high-frequency analog and high-speed digital designs, will take place at the Hynes Convention Center, September 11-13 in Boston, Mass. The event management team is pleased to announce this year’s conference chairs: Thomas Cameron, CTO for the Communications Business Unit at Analog Devices Inc. will serve as the chair for the high-frequency subject areas, and Istvan Novak, senior principal engineer at Oracle, will serve as the chair for the high-speed digital areas of the conference.

Signal Integrity Journal, a new sister publication to Microwave Journal covering signal integrity, power integrity and EMC/EMI related topics, has secured seven sponsors to start the new year. The Platinum Level sponsorships are sold out for 2017 with industry leaders Rohde & Schwarz, Anritsu, Mentor Graphics and CST filling the top sponsorship level. Joining them are Cadence and Samtec at the Gold Level and Passives Plus at the Silver Level.

Digitaltest Inc., a leader in Flying Probe, In-Circuit, Functional Test and Production Software Solutions will be demonstrating their latest flying probe solutions, engineering data exchange tools, back-end quality management software and their ICT systems at the IPC Apex show in San Diego, CA, Booth 422, February 14-16, 2017.