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Molex announced today it has teamed up with BlackBerry Limited on the development of a 10 Gbps Ethernet Automotive Networking platform designed to increase data bandwidth in intelligent connected vehicles.

Harwin has announced the introduction of a new female contact for its Datamate connectors that enables significant increases in power delivery levels to be realized. Utilizing a unique, proprietary 6-finger design which is machined from a single piece of beryllium copper, the T-Contact raises the current capacity on compact 2mm pitch interconnection systems, with up to 8.5A per contact being supported.

With effect from 1 January 2018, Intersil Corporation began operating in the market under the name of Renesas Electronics America Inc.

Indium Corporation will feature Indium11.8HF-SPR Solder Paste – a new air and nitrogen reflow, no-clean, Pb-free solder paste designed to meet the fine feature printing requirements of mobile manufacturers – at IPC APEX Expo 2018, Feb. 24-March 1 in San Diego, Calif.

Picotest.com, has released a new solid-state Semi-Floating Amplifier (SFA), or ground loop isolator, that provides the BEST isolation for low impedance measurements. The new amplifier eliminates the DC ground loop from DC up to 800MHz.

Analog Devices, Inc. announces the Power by Linear™ LT8364, a current mode, 2MHz step-up DC/DC converter with an internal 4A, 60V switch. It operates from an input voltage range of 2.8V to 60V, and is suitable for applications with input sources ranging from a single-cell Li-Ion battery to multicell battery stacks, automotive inputs, telecom power supplies and industrial power rails.

Passive Plus, Inc. (PPI) now offers extended-values for the Traditional NP0, Hi-Q 0505 (.055” x.055”) -- now available up to 1,000pF; and 1111 (.110” x.110”) -- now available up to 10,000pF (.01uF). The 0505 and 1111 have an increased Operational Temperature up to 200°C.

Industrial designers can now achieve 2x faster data rates and extend cable length by up to 50% with MAX22500E, MAX22501E, and MAX22502E RS-485 transceivers from Maxim Integrated Products, Inc.

IPC - Association Connecting Electronics Industries® announced today the October 2017 findings from its monthly North American Printed Circuit Board (PCB) Statistical Program. Positive year-over-year shipment and order growth continued October. The book-to-bill ratio remained high in October at 1.12.

Researchers at the National Institute of Standards and Technology (NIST) have invented a new approach to testing multilayered, three-dimensional computer chips that are now appearing in some of the latest consumer devices. The new method may be the answer the semiconductor industry needs to quickly assess the reliability of this relatively new chip construction model, which stacks layers of flat circuitry atop one another like floors in a building to help make chips ever-faster and packed with features.