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An EcoTemp Series FoF 619 gasket from Laird Performance Materials features a soft silicone foam core with a low compression force that suppresses electromagnetic interference without damaging sensitive components.

Pico Technology announced the development of its PicoScope 6000E Series oscilloscopes with the launch of three 4-channel models, each of which can be configured with 16 optional digital channels.

Teledyne e2v has announced the DDR4T04G72M. The first radiation-tolerant DDR4 memory chip, featuring a total 4GB capacity. Currently validated at 2133MT/s, and targeting to offer 2400MT/s in the near future, this next-generation solution offers ultra-responsive low latency operation, while fitting into a highly compact form factor.

Amphenol RF has introduced HD-BNC dual port PCB jacks into a portfolio of 12G optimized interconnects. This connector configuration allows for dual port termination and increases connector density while saving valuable PCB real estate, eliminating the need for risers or mezzanine connectors.

HENSOLDT together with Nano Dimension, has achieved a major breakthrough on its way to utilizing 3D printing in the development process of high-performance electronics components.

In a joint study with the Chalmers University of Technology Department of Microtechnology and Nanoscience, SweGaN explored QuanFINE® epitaxial wafer performance, based on GaN HEMT technology at Chalmers, Gothenburg, Sweden. The study revealed that the concept using a total GaN layer thickness of 250 nm does not compromise the material quality and device performance.

Keysight Technologies, Inc., announced the first, cost-effective test solution that enables data center operators to leverage 400 Gigabit Ethernet (GE) capable test ports to link with and test legacy 100GE network equipment.

Horizon House announced that EDI CON CHINA has been rescheduled for October 13 and 14, 2020 at the Chinese National Convention Center (CNCC), Beijing, China.

Keysight Technologies, Inc. announced the first oscilloscope with eight analog channels at 6 GHz and 16 simultaneous digital channels, enabling customers to reduce test bench and workflow complexity to achieve higher performance as well as accurate and repeatable multi-channel measurements in a single instrument. 

DuPont Electronics & Imaging Interconnect Solutions (ICS), introduced metallization offerings in advanced development stages for High-Density Interconnect (HDI) applications, a high-performance and fast-growing segment of the printed circuit board (PCB) industry.