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ZTE Corporation announced a new-generation architecture solution for single-wavelength 50G-PON bi-directional symmetrical transmission and a video transmission solution that was tested on the basis of commercial G-PON technology at the 43rd edition of the Optical Fiber Communication Conference and Exposition (OFC) recently held at the San Diego Convention Center, California, USA.

Silicon Labs has introduced a new family of low-power PCI Express® (PCIe®) Gen 1/2/3/4 clock buffers that provide ultra-low jitter clock distribution in 1.5 V and 1.8 V applications.

Tektronix, Inc., introduced the 56 GBd 400G PAM4 optical probe for use with Tektronix DPO70000SX Series real-time oscilloscopes. Joining the 33 GHz DPO7OE1 introduced last year, the new 59 GHz DPO7OE2 single mode optical probe delivers the performance and advanced debug capabilities designers need to troubleshoot 400G PAM4 components and reduce time to market.

Tektronix, Inc. introduced two new optical modules for its DSA8300 sampling oscilloscope that offers the highest sensitivity and lowest noise, giving manufacturers the confidence they need to increase production capacity and improve yields for 400G designs moving into production.

The new EMI receiver TDEMI® ULTRA from GAUSS INSTRUMENTS provides industry-leading features, such as a 685 MHz real-time bandwidth, fast receiver scanning and multi GHz real-time scanning up to 40 GHz. It is a multi-purpose instrument for a wide range of applications and due to its compact design, a 12V supply, and a weight of less than 10 kg it is a fitting tool for field testing or on-board testing applications.

Teledyne e2v is launching a complete GaN power solution based on technology from pSemi (formerly Peregrine Semiconductor) and GaN Systems. The solution features GaN FETs and the industry’s first rad-tolerant, half-bridge power driver for GaN high-reliability applications. The technology will be demonstrated at Satellite 2018 March 12-15 in the Teledyne Defense Electronics booth (#619).

Richardson RFPD, Inc. announced today the availability and full design support capabilities for a new insulated metal substrate (IMS) evaluation platform from GaN Systems Inc.

TDK Corporation presents an extremely compact EPCOS film capacitor for the DC link of inverters. With dimensions of just 40 mm x 58 mm (d x l) it offers a rated voltage of 350 V DC and a capacitance of 65 μF.