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The UK Government has announced the first wave of funding through UK Research and Innovation’s flagship Strength in Places Fund in which a major £43.74M project, “CSConnected,” with South Wales’ compound semiconductor cluster has been approved and will be supported by £25.44M funding from Strength in Places.
Anritsu Company expands its W1 (1.0 mm) component line with the introduction of bias tees, DC block, and semi-rigid cables that operate to 110 GHz and provide broadband frequency scalability in high-frequency device characterization and optical networking applications.
Infineon Technologies AG, is expanding its product offering for battery management systems with a sensing and balancing IC, the TLE9012AQU. The device is especially designed for batteries in hybrid and electric cars, but it is also suitable for other applications.
RFMW announced design and sales support for solderless PCB connectors from Rosenberger North America. Easily mounted to printed circuit boards using standard screws, the 08K721-40MS3 connector is cost-effective yet designed to provide excellent return loss values for frequencies up to 70 GHz.
Keysight’s three-day Optical Networking Innovations event will enable attendees to experience the company’s range of test solutions across all network layers and technologies for optical transmission and data center interconnect, accelerating development of intelligent networks.
CEA-Leti announced the demonstration of a fully packaged CWDM optical transceiver module with data transfer of 100 Gb/s per fiber with a low-power-consumption electronic chip co-integrated on the photonic chip.
Besides a range of flat flexible cables (FFCs) and lockable ZIF (Zero Insertion Force) plug connectors, Würth Elektronik now also offers the LIF (Low Insertion Force) connector WR-FPC.
Cinch Connectivity Solutions, expands the Johnson 2.92 mm connector offering with a new 45° connector version. This connector is uniquely designed for quick and easy mounting in tight spaces, where height or board edge can be restrictive and an angled design is preferred.
LoadSlammer, Steve Sandler and Picotest have entered into a joint partnership agreement. Collaborating on a series of next generation products, the PicoSlammer™ products will support the next generation of advanced digital chips used for data processing.
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