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MACOM, announced an analog and silicon photonics portfolio for seamless integration in 50Gbps, 100Gbps, 200Gbps and 400Gbps optical modules targeted for compliance with the newly formed Open Eye Multi-Source Agreement (MSA).

At PCIM 2019, imec, announced that it demonstrated a functional GaN half-bridge monolithically integrated with drivers. Mounted on a buck-convertor test board, the chip converts an input voltage of 48 Volt to an output voltage of 1 Volt, with a pulse width modulation signal of 1 MHz.

The R&S CMX500 radio communication tester from Rohde & Schwarz brings extensive device testing capabilities to the market, covering standalone (SA), non-standalone (NSA), TDD, FDD, FR1 and FR2.

Littelfuse, Inc. introduced two series of bidirectional TVS Diode Arrays (SPA^® Diodes) designed to protect high speed consumer electronics interfaces from damaging electrostatic discharge (ESD) in applications where PCB layout is especially challenging.

Infineon Technologies AG is introducing its zero-voltage-switching (ZSC) switched capacitor converter. It features a two-stage architecture for 48 V applications to power up CPUs, GPUs, SoCs, ASICs, and memory.

Rohde & Schwarz will present its family of oscilloscopes and power supplies for power electronics applications at PCIM Europe International Exhibition and Conference from May 7 to 9, 2019, in Nuremberg.

Tektronix, Inc. announced that Tami Newcombe has been promoted to President of Tektronix. Newcombe joined Tektronix in early 2017 as Commercial President and has been responsible for leading global sales and marketing.

Silicon Labs has introduced a comprehensive portfolio of timing solutions that provide jitter performance to meet the latest generation PCI Express^® (PCIe) 5.0 specification with significant design margin.

Kyocera Corporation and Vicor Corporation will collaborate on next-generation power-on-package solutions to maximize performance and minimize time-to-market for emerging processor technologies.