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Samtec announces the release of mPOWER connectors – the micro high-power solution with design flexibility for power-only or power/signal applications.

Silicon Labs has introduced a family of isolated analog amplifiers, voltage sensors and delta-sigma modulator (DSM) devices designed to provide accurate current and voltage measurement with very low drift across temperature.

TE Connectivity (TE) is introducing a new series of Ethernet jacks with integrated magnetics and Power over Ethernet (PoE) specifically designed for industrial applications which help to simplify PCB design efforts and simplify peripheral powering in the total system.

EDI CON China 2019 taking place April 1-3, 2019 at the China National Convention Center in Beijing has announced the finalists in the second annual EDI CON China Product Innovation Awards.

At EMV in Stuttgart, Rohde & Schwarz will demonstrate highlights such as the new R&S ELEKTRA EMC test software for automated certification and precompliance tests and R&S AdVISE for automated visual checks. Brand new are the test solutions for spurious emission measurements for 5G components.

Dialog Semiconductor plc, announced the SmartBond DA1469x family of Bluetooth low energy SoCs, its advanced range of multi-core microcontroller units (MCUs) for wireless connectivity.

Keysight Technologies, Inc. announced it is exhibiting the company's newest optical and high-speed digital test solutions at OFC 2019, booth 2600, San Diego Convention Center, March 5th – 7th, 2019.

Anritsu Company enhances its Signal Quality Analyzer-R MP1900A BERT with the introduction of four PAM4 BERT options adding multichannel synchronization, multilane FEC pattern generation for 400GbE, inter symbol interference (ISI) stressed signal generation to simulate transmission path losses, and application software for capturing device under test (DUT) error counts.

Teledyne LeCroy, Inc., announced and demonstrated the first protocol analyzer platform for testing next-generation USB4 and Thunderbolt 3 systems.

MACOM Technology Solutions Inc., and GLOBALFOUNDRIES announced a strategic collaboration to ramp MACOM’s Laser Photonic Integrated Circuit (L-PIC) platform using GF’s current-generation silicon photonics offering, 90WG, to meet data center and 5G telecom industry demands.