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Cadence has achieved a significant milestone by designing and taping out its first-ever system chiplet, marking a groundbreaking advancement in chiplet realization capabilities. 

Akash Systems has signed a preliminary memorandum of terms with the U.S. Department of Commerce under the CHIPS and Science Act to receive over $68 million in direct funding

Designed for the edge computing era, Innodisk’s E1.S SSD aims to boost performance in AI and edge applications with high reliability and efficiency.

Microchip’s IGBT 7 portfolio is available with multiple topologies, current, and voltage ranges.

Richardson Electronics, Ltd. and Navitas Semiconductor have announced an expanded distribution partnership for next-gen silicon carbide power semiconductors for Europe, the Middle East, and Africa.

Renesas Electronics Corporation has announced new AnalogPAK ICs, including lower power and automotive-qualified devices along with the industry’s first programmable 14-bit SAR ADC.

VIAVI Xgig CXL Exerciser has received CXL 2.0 Gold Suite certification from the Compute Express Link Consortium. 

Pico Technology has significantly enhanced its PicoScope 9400 Series by launching the PicoScope 9404A-25, a high performance oscilloscope offering an impressive 25 GHz bandwidth on four channels.

Samtec, Inc. announced full production quantity availability of its LL043 Series Nitrowave™ high performance microwave cable assembly.

Rohde & Schwarz enhances its portfolio of entry‑level oscilloscopes with the R&S RTB 2, the successor to the popular R&S RTB2000 oscilloscope.