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Advanced Thermal Solutions, Inc., ATS, has expanded its line of flat and round copper heat pipes for electronics thermal management. More than 350 standard ATS heat pipes provide low cost cooling solutions for cloud and edge computing, electric vehicles, aerospace, agtech, robotics, medical and consumer electronics, data communications, telecommunications, HVAC and more.

EDI CON Online, a new interactive event being held online September 10-12, 2019, has opened registration for its three days of tracks: 5G/IoT (September 10), Radar/Antenna (September 11) and Signal Integrity/Power Integrity (September 12), with EMC/EMI topics spread throughout the tracks.

In order to provide customers with simple plug-and-play solutions, Harwin has now introduced a range of off-the-shelf cable assemblies to accompany its popular Datamate series of high reliability connector components.

Teledyne LeCroy released a new Automotive Ethernet Debug Toolkit + Automotive Ethernet Breakout Test Fixture.

Rohde & Schwarz hosted partners and guests from the UAM Ingolstadt Initiative at the company headquarters in Munich for the fourth network meeting.

Tektronix, Inc. introduced the 6 Series Low Profile Digitizer, the first 4-channel digitizer to offer up to 8 GHz bandwidth, 25 GS/s sampling rate and a 12-bit ADC on every channel, all in a space-saving 2U rack form factor.

Nano Dimension Ltd., introduced its new DragonFly Lights-Out Digital Manufacturing (LDM) printing technology, a comprehensive additive manufacturing platform for round-the-clock 3D printing of electronic circuitry.

Picotest.com, has released a new ‘FRA Bundle’ of signal injectors that enables Bode plots and PSRR (power supply rejection ratio) measurements for Keysight, Tektronix, Siglent, and Rohde & Schwarz oscilloscopes.

Cinch Connectivity Solutions, a Bel group company, announces new configurations of MIL-STD-1553 twinax cable assemblies, designed for military and commercial aerospace, ground vehicles, weapon systems, and space applications.

TE Connectivity (TE), introduced its new quad small form factor pluggable double density (QSFP-DD) connectors, cages and cable assemblies, which address next-generation data center needs by increasing density through an existing QSFP form factor to reach speeds up to 400 Gbps.