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Teledyne e2v is moving ever closer to its goal of bringing about a major overhaul of the signal chain—through the availability of its latest performance-redefining digital-to-analog converters (DACs). 

Rohde & Schwarz releases the R&S®SAM100, the microwave amplifier sets new standards in ease of operation, robust design and super-compact footprint within the 2 to 20 GHz range with up to 20 W output power.

Richardson Electronics, Ltd. strengthens its RF offering with Masach Tech™ EMI/RFI shields. These rigid, very planar parts are designed for reflow solder and have a removable lid to allow for much easier component troubleshooting and repair.

HUBER+SUHNER (UK) Ltd. has been recognized with the Bronze Performance Standard Supply Chains for the 21^st Century (SC21) award by ADS, the UK trade organization for Aerospace, Defense, Security, and Space, for its commitment toward technical excellence and the continual improvement of its production performance.

Indium Corporation and RENEX Group have formed a strategic partnership for the service of their PCB and engineered solder materials in Poland. 

Pixus Technologies has announced OpenVPX backplanes designed for horizontal-mount enclosures.

Teledyne LeCroy announced the DDR5 Debug Toolkit for SDA 8 Zi-B and LabMaster 10Zi-A oscilloscopes.

Marvell Technology Group Ltd., and Inphi Corporation announced a definitive agreement, unanimously approved by the boards of directors of both companies, under which Marvell will acquire Inphi in a cash and stock transaction.

The Society of Women Engineers’ WE20 is now a two-week virtual conference and career fair scheduled for November 2-13, 2020. 

OnScale announced the release of the OnScale Solve, the web-based cloud engineering simulation platform bringing to engineers powerful multiphysics solvers and scalable cloud supercomputer resources.