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HUBER+SUHNER will display its latest solutions to meet the technological challenges of test and measurement applications at DesignCon 2020 in Santa Clara, California.

Mercury Systems, Inc., announced the EnsembleSeries SFM6126 OpenVPX PCI Express (PCIe) gen 3 switch with capabilities for creating a true composable data center edge processing architecture for aerospace and defense applications.

Rohde & Schwarz developed a powerful method for analyzing the individual components of jitter, providing electronic circuit designers with previously unavailable in-depth knowledge invaluable for debugging high-speed signals.
 

Zentech Manufacturing, Inc., announced the acquisition of Trilogy Circuits, LLC.

Infineon Technologies AG, is taking the next step towards smallest power supply devices for automotive electronics. As first chipmaker, the company set up a dedicated production process for flip-chip packages that is fully aligned with the high-quality requirements of the automotive market.

Keysight Technologies, Inc. announced that it will introduce the world's first design and test workflow solution that reduces product development time for double-data rate dynamic random-access memory (DDR5 DRAM) systems at DesignCon 2020 (Booth 725).

TE Connectivity (TE) will educate and inspire system designers at DesignCon 2020 by demonstrating an array of solutions for next-generation compute and networking systems.

Keysight Technologies, Inc., and Silicon Labs announced a collaboration that streamlines the validation of timing solutions in the development of system-level designs for wireless communications, high-speed digital, medical imaging and automotive applications.

Epson and Rohde & Schwarz, announced their joint development of a modern test procedure for measuring power supply noise rejection to bring clarity and precision to real-world signal integrity design challenges.

Signal Microwave has launched a new line of higher performance edge launch connectors designed for the thinner substrates used today.