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Richardson RFPD, Inc. announced the availability and full design support capabilities for a new gate driver integrated circuit from Power Integrations, Inc.

Coilcraft’s new Cx Family of surface-mount common mode chokes includes 16 sizes/configurations for a broad range of power line circuits. They suppress high frequency common mode noise up to 100 MHz and offer greater than 40 dB common mode attenuation, making them ideal for use in consumer electronics and industrial applications.

Elma Electronic Inc. has expanded its popular line of E-Frame test and development platforms to include a 3U CompactPCI Serial-based system designed for high-speed data processing. 

Silicon Labs has expanded its family of Si539x jitter attenuators with new device options featuring a fully integrated reference, enhancing system reliability and performance while simplifying PCB layout in high-speed networking designs.

Samtec Inc., will showcase and demonstrate their latest high-performance interconnect and technologies at the PCI-SIG® Developers Conference 2019.

Richardson RFPD, Inc. announced the availability and full design support capabilities for a new silicon carbide module from Wolfspeed, a Cree Company.

imec, demonstrates a field-free switching operation of spin-orbit torque MRAM (SOT-MRAM) devices – eliminating the need for an external magnetic field during write operation. The concept is manufacturing-friendly and does not compromise the reliability and sub-ns writing performance of the SOT-MRAM devices.

KEMET Corporation expanded the temperature capability of T598 devices, a Tantalum Polymer Surface Mount Capacitor. These devices address the stringent requirements and new challenges presented by megatrend applications in automotive Advanced Driver Assistance Systems (ADAS), autonomous driving and in digitalization uses such as supercomputing, mobility services, connectivity and infotainment.

The European cooperation project Power2Power has started. Over the coming three years, 43 partners from eight countries will research and develop  power semiconductors with more power density and energy efficiency. Power semiconductors are needed in all stages of energy conversion: generation, transmission, and use. More efficient semiconductors make a major contribution towards reducing carbon dioxide emissions in spite of the world's growing energy needs. Universities, research institutes, small and medium-sized companies and international corporations are involved in this cooperation. Infineon Technologies Dresden GmbH & Co. KG is coordinating this project.

Teledyne LeCroy introduced its WavePulser 40iX high-speed interconnect analyzer, a capable solution for complete interconnect testing and validation.