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Featuring low 0.88 mm profile and wettable flanks, Automotive Grade 200 V, 400 V, and 600 V devices provide improved thermal performance and efficiency.

New pTLA to offer industry-best combination of size, affordability, and performance to meet the demand for 100G coherent at the edge.

Launched by Infineon Technologies AG, the new SEMPER Nano NOR Flash memory is optimized for battery-powered, small-form-factor electronic devices.

IDTechEx’s new “Automotive Semiconductors 2023-2033” report focuses on the areas of automation and electrification, explaining what semiconductor technologies are needed and how their growth is going to drive a 10-year CAGR of 9.4% in the automotive semiconductor market.

New software option permits time-correlated viewing and analysis of oscilloscope and protocol analyzer USB4 traces.

New software tools support faster 64 GT/s data transfer speeds using PAM4 multi-level signaling.

Past and present officers gather to celebrate IBIS – and cut the cake!

Teledyne e2v and Texas Instruments (TI) have collaborated on a new radiation-tolerant DDR4 modular platform to help satellite OEMs streamline their system development work.

Ramping up production at its Colorado Springs fabrication campus will enable Microchip to respond to growing semiconductor demand across a wide swath of industries.

Anritsu Company demonstrates solutions, technologies, and methodologies to verify high-speed communications designs during DesignCon 2023.