Articles by Cadence

Cadence has achieved a significant milestone by designing and taping out its first-ever system chiplet, marking a groundbreaking advancement in chiplet realization capabilities. 

In a commitment to building a culture that fosters inclusion and embraces diverse backgrounds, experiences, and ideas, Cadence offers the Cadence Women in Technology, Black Students in Technology, and Latinx Students in Technology Scholarships for eligible students and interns.

Next-generation wireless communication and radar systems demand increased RF power within a smaller footprint to meet performance and size requirements. This paper discusses the impact of operating temperature on RF device performance and reliability and presents a thermal analysis solution based on FEA that is integrated within a dedicated RF component design platform.

This white paper highlights Sigrity X features for SI and PI analysis that enable designers to cut design respins and meet short time-to-market windows with confidence. 

This white paper demonstrates a high-current motor controlling PCB solution for the automotive industry that utilizes the Celsius solver to optimize the PCB design, as well as electrothermal co-simulation to uncover thermal issues in the leadframe package.

This white paper describes the Cadence® Clarity™ 3D Solver Cloud, a straightforward, secure, and cost-effective approach to executing 3D EM simulations using the robust compute resources available in the cloud.

This white paper helps designers understand the cross-fabric thermal and stress challenges introduced by 3D-ICs and how the Cadence® Celsius™ Thermal Solver enables designers to develop strategies to mitigate these impacts.

This white paper highlights the features in Cadence® Sigrity™ X signal and power integrity (SI/PI) solutions for system-level SI and PI analysis. Read on for more.