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As a global leader in signal integrity, Samtec’s in-house engineering team utilizes EDA tools across the industry via our global 24/7 support of customer SI designs and applications. Our experience with these tools enables unique collaborations with EDA suppliers and industry leading technical events.
Samtec, a privately held $662MM global manufacturer of a broad line of electronic interconnect solutions, proudly announces the Consortium for On Board Optics (COBO) has adopted a two-piece surface mount connector system based on Samtec’s FireFly™ Micro Flyover System™ for the next generation of standardized on-board optical modules.
Samtec Microelectronics provides complex package assembly, including precision die attach and ultra-fine pitch wirebond, for a variety of traditional and glass substrates, with expertise in packaging and substrate design, stacked die and multi-chip modules.
The Signal Integrity Group provides in-house signal integrity expertise for complex applications, with live EE support available 24/7 worldwide. Services include full-channel analysis, high-data rate simulations, and application-specific design and development assistance. Teraspeed® Consulting offers Tier 1 level signal integrity expertise and capabilities delivered directly to your engineering team.
The FireFly™ Micro Flyover System™ gives designers the flexibility of using micro footprint optical and copper interconnects interchangeably with the same connector system. The Industry-leading miniature footprint allows for higher density close to data source. The data “flies” over lossy PCB for up to 28 Gbps per lane.
Samtec Microelectronics provides complex package assembly, including precision die attach and ultra-fine pitch wirebond, for a variety of traditional and glass substrates, with expertise in packaging and substrate design, stacked die and multi-chip modules.
The Signal Integrity Group provides in-house signal integrity expertise for complex applications, with live EE support available 24/7 worldwide. Services include full-channel analysis, high-data rate simulations, and application-specific design and development assistance. Teraspeed® Consulting offers Tier 1 level signal integrity expertise and capabilities delivered directly to your engineering team.
The FireFly™ Micro Flyover System™ gives designers the flexibility of using micro footprint optical and copper interconnects interchangeably with the same connector system. The Industry-leading miniature footprint allows for higher density close to data source. The data “flies” over lossy PCB for up to 28 Gbps per lane.