Articles by Keshav Amla

Copper foil and oxide roughness are also major drivers of insertion loss behavior. As discussed in Part 1 of this article series, the first crucial step to efficacious design and development is understanding how the dielectric material attributes are to be carefully considered when assessing impedance and insertion loss performance. This article by Keshav Amla highlights the importance of considering roughness attributes in this assessment, ensuring a well-rounded approach to addressing impedance and loss, as well as skew, a signal integrity concern of ever-increasing importance.

This article series by Keshav Amla of Avishtech provides an introduction and overview of the dielectric materials upon which a PCB is built, focusing on what comprises these materials; the data available from the materials vendors; how the key material attributes drive performance; and how these ideas can be leveraged in the development of new product implementations.