Pat Hindle, SIJ Contributing Editor

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Pat Hindle is responsible for editorial content, article review and special industry reporting for Signal Integrity Journal and Microwave Journal magazines plus their web sites. He also leads social media and special digital projects. Prior to joining the Journals, Mr. Hindle held various technical and marketing positions throughout New England, including Marketing Communications Manager at M/A-COM (Tyco Electronics), Product/QA Manager at Alpha Industries (Skyworks), Program Manager at Raytheon and Project Manager/Quality Engineer at MIT's Space Nanostructures Laboratory. Mr. Hindle graduated from Northeastern University - Graduate School of Business Administration and holds a BS degree from Cornell University in Materials Science Engineering.

Engineer What’s Next – NIWeek 2017

May 30, 2017

Patrick Hindle

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This is the first year that NIWeek has taken place in late May instead of its normal early August time slot and switches permanently to this part of the calendar. NIWeek 2017 kicked off with new CEO Alex Davern paying tribute to Dr. T with a standing ovation from the audience. Read this summary of what happened at NIWeek 2017.

Compatibility in the Capital - IEEE EMC 2016

July 31, 2016

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EMC 2016 featured Dr. Robert Scully, NASA Johnson Space Lab, kicking off the plenary session with his light hearted talk, “EMC in 2016 and Beyond: What Is It and Why Do We Care?”. As the IEEE EMC is an international organization, they periodically hold EMC outside of the US so traveled to Ottawa, Canada this year.

FCC Chairman Lays Out Innovation Based 5G Plan

Recommends Spectrum Allocation through mmWave Bands

June 21, 2016

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FCC Chairman Tom Wheeler laid out his proposal for 5G spectrum allocation that he hopes will be approved by Congress on July 14. It is a comprehensive plan to designate spectrum in the low frequency bands, develop more mid-band frequencies in the crowed areas currently used and a gives specific focus to high frequency bands in the mmWave range. He stated that we will be the first in the world to approve these types of measures if Congress gives their approval next month.

Meeting Chiphead

DesignCon 2016 Summary

January 29, 2016

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It was fun meeting Chiphead for the first time at DesignCon 2016. The event covers areas such as PCB design tools, power and signal integrity, jitter and crosstalk, high-speed serial design, test and measurement tools, parallel and memory interface design, ICs, semiconductor components and more. The test/measurement, software and connector companies dominate the exhibition. As the speed of digital electronics has increased, the techniques and methods for digital and RF/microwave design have converged so it was interesting to see the similarities between the two worlds.