Market Perspectives Guest Blog

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Artificial intelligence-generated content is rewriting the rules for data center networks, driving a need for extreme throughput and density at unprecedented scales. To meet these requirements, hyperscalers need high-performance 800G network solutions as quickly as vendors can deliver them.

In this article, Yuriy Shlepnev provides an overview of Simbeor electromagnetic signal integrity software and highlights its new features.

As AI and ML technologies continue to evolve and become more prevalent in various industries, the demand for faster and more efficient data transfer methods will undoubtedly grow. In this guest blog, VIAVI reviews how PCIe 6.0 and CXL 3.x, with their advanced capabilities and perfect alignment, are already paving the way for rapid innovation in AI/ML use cases. 

This application note demonstrates use of HYPERLABS’ broadband coaxial components as general-purpose analog signal processing components for the generation of novel time-domain waveforms. The HL9474 6 dB resistive power divider and HL9462 Z-matched pick-off tee are demonstrated as lossy broadband summing networks. The HL9404 broadband balun is demonstrated as a pulse inverter and 180° signal splitter. The HL5567 PAM4 encoder is used to combine two pseudorandom binary or bit sequence (PRBS) patterns into PAM4 signaling. Utilizing the basic arithmetic functions of addition, inversion and subtraction, together with a time delay, a wide variety of novel broadband waveforms are generated. 

This application note builds on prior work reported in Picosecond Pulse Labs (PSPL) Application Note AN-20a^_[1]. In the referenced note, Jim Andrews, Ph.D. used PSPL pulse generators together with PSPL passive components to produce a variety of novel waveforms. A similar set of waveforms are demonstrated at higher bandwidths in this application note utilizing HYPERLABS’ industry leading broadband passive components.  

The higher speed of USB4 has prompted a move to retimers and away from redrivers within USB-C systems. This article describes the method of designing retimers into USB4 systems.

Semiconductor ICs are the key components of complex electronic circuits. In countless technical applications, these small processing, control and memory components help master the great challenges of our time.

This is an overview of how Ansys 3D components with design encryption offered a way for Samtec to share designs with their customers, allowing them to design Samtec interconnects into their systems.

As electronics package sizes become smaller and more densely packed, it is necessary to optimize the entire signal path to reduce signal loss and eliminate interference. See more.

In lieu of the given applications and industry efforts, many enterprises and industries are now viewing silicon photonics as an inevitable component for computers and monitoring devices. As the technology is touted to mature in the coming years, chances are that supercomputers would likely reach the exascale speed around human brain’s processing power at the neural level.

One of the main challenges of performing analysis upstream is incomplete models used in analysis. Normally the full physical layouts from which extractions are performed on interconnect do not yet exist. So how does one fill in the blanks to perform early analysis?