Title: Best Design Practices to Eliminate Ground Bounce in Your Next Product

Date: September 12, 2019

Time: 10:00am PT / 1:00pm ET

Presented by: Eric Bogatin, Techical Editor, SIJ

Abstract:

The fastest way to fix or prevent a problem is to identify its root cause and fix it at the source. Ground bounce is a type of cross talk related to return path discontinuities. We will look at a few examples of design features that cause ground bounce, and how to avoid this problem in your next product. We will use measurements of two board designs, one done correctly and one with ground bounce errors to verify our best design practices. After we explore the root cause and how to prevent ground bounce, you should never suffer this problem again.

Presenter Bio:
Eric Bogatin is the Technical Editor at Signal Integrity Journal and the Dean of the Teledyne LeCroy Signal Integrity Academy. Additionally, he is an Adjunct Professor at the University of Colorado-Boulder in the ECEE Dept. Eric improves the signal to noise ratio by sorting through all of the information available and finding the best quality content to publish on signalintegrityjournal.com. 

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