EDI CON Online

Title: Exploring Power Dissipation Thermal Ratings for Fixed Attenuators 

Date: October 13, 2020

Time: 10:30am PT / 1:30pm ET

Sponsored by: International Manufacturing Services Inc. (IMS)

Presented by: Wes Laquerre, Application Engineer

Abstract:
A number of thermal/power design challenges are found when PCB Designers evaluate the use of fixed attenuators.

It is helpful to explore and understand relationships of applied power, dissipated power and the factors involved across multiple dB values of attenuators whether fixed in a component network or created using discrete individual resistors on a PCB.

Understanding all factors involved with properly rating attenuators offers a useful insight into practical challenges. Further, understanding the best practices on how to self-evaluate applications and apply them to the components required to realize designs becomes even more beneficial to designers. Some factors explored here include termination style, pad and via sizing, operating temperature, component substrate, resistor size, trim style and tolerance as they relate to power/thermal performance. Some insights into balancing RF and power performance will also be explored.

Presenter Bio:

Wes Laquerre is the Applications Engineer at International Manufacturing Services (IMS). Wes joined IMS in 2019 after several years supporting digital audio applications. He has contributed at IMS in new product development and technical customer support. Wes manages customer application studies with a specialty in EM simulation and investigating the effect of physical component features as they relate to installed RF performance. 

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