Online Panel Series

Title: Online Panel: Practical Connector Characterization Techniques

Date: April 29, 2021

Time: 8am PT / 11am ET

Sponsored by: Samtec and Molex

Many papers are published about building models of interconnect structures such as connectors. But what is done in practice? In this panel, we gather industry leading suppliers of connector components and simulation software and give them a chance to show off the methods they use on a daily basis to model or verify high bandwidth electrical models of their components. Sometimes there are multiple right answers. Hear what industry experts have to say.

Moderator: Eric Bogatin, Professor at ECEE Univ of Colorado, Boulder, Technical Editor for Signal Integrity Journal, and Teledyne LeCroy Fellow
Panelist: Steve Krooswyk, Senior SI Design Engineer, Samtec, Inc.
Panelist: Vivek Shah, Director, New Product Development - Copper Solutions Business Unit, Molex
Panelist: Amir Asif, Lead Product Engineer - Multi-domain System Analysis, Cadence 

Panel Participant Bios:

Moderator

Eric Bogatin, Professor at ECEE Univ of Colorado, Boulder, Technical Editor for Signal Integrity Journal, and Teledyne LeCroy Fellow

Eric Bogatin is the technical editor at Signal Integrity Journal and the Dean of the Teledyne LeCroy Signal Integrity Academy. Additionally, he is an Adjunct Professor at the University of Colorado-Boulder in the ECEE Dept. Eric improves the signal to noise ratio by sorting through all the information available and finding the best quality content to publish on Signal Integrity Journal.

Samtec

Steve Krooswyk, Senior SI Design Engineer, Samtec, Inc.

Steve Krooswyk is a Senior Signal Integrity Design Engineer at Samtec.  His 18 years of experience includes contributions to the design, simulation, and correlation of interconnect and I/O, as well as an influential role in industry standards.   Prior to this, Steve was the PCI Express technical lead for Intel Data Center Group, and he co-authored the book “High Speed Digital Design:  Design of High-Speed Interconnects and Signaling.”  Steve received his M.S. in Electrical Engineering from the University of South Carolina.

Molex

Vivek Shah, Director, New Product Development - Copper Solutions Business Unit

Vivek Shah, Director, New Product Development is responsible for leading the development of high-speed products in Copper Solutions Business Unit at Molex. He has more than 10 years of experience in design and development of high-speed products such as backplane connectors, IO connectors and cable assemblies. His experience extends from Signal Integrity and Mechanical Engineering through Product Marketing and have successfully launched products from 25Gbps to 112Gbps data rates. Vivek holds MS degree in Electrical Engineering from Purdue University and BS in Electronics Engineering from Maharaja Sayajirao University, India.

Cadence

Amir Asif, Lead Product Engineer - Multi-domain System Analysis

Amir A. Asif is actively working with electromagnetic extraction and modeling of electrical designs. He is currently serving as a Lead Product Engineer, focusing on Finite Element Method and Method of Moment tools, at Cadence Design Systems. Previously, he served at Ansys, Inc. and Lorentz Solutions, Inc. Throughout his career, he has worked on EM simulations involving different technologies and different designs involving IC, Packages, PCB, etc. As a team member of simulation tool provider companies, he has collaborated and worked with designers from leading companies in electronics industry. Dr. Asif received his PhD from Clemson University, South Carolina, USA, and Bachelor from Bangladesh University of Engineering and Technology (BUET), Bangladesh. 

Please note:
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