High Speed Digital 3D EM Forum

Title: KEYNOTE: Interconnect Modeling and Its Importance to HSSD Simulation

Date: May 26, 2021

Time: 10:00am PT / 1:00pm ET

Presented by: Eric Bogatin, Professor at ECEE Univ of Colorado, Boulder, Technical Editor for Signal Integrity Journal, and Teledyne LeCroy Fellow

Abstract:
We measure real world structures, but we simulate ideal structures. The first step in an accurate simulation is starting with an accurate model of both the drivers and receivers and the interconnect elements. With accurate material properties, uniform transmission line structures can be accurately modeled. Discontinuity structures such as DC blocking capacitors, connectors and vias can be modeled using a 3D full wave solver with outputs in the form of S-parameters. From either measured or simulated S-parameters of a structure, simple figures of merit such as the excess capacitance and inductance or a transmission line model can be fit by hacking the S-parameters. Examples of some of these valuable techniques to model interconnects for integration into circuit simulations will be shown.

Presenter Bio:
Eric Bogatin is the technical editor at Signal Integrity Journal and the Dean of the Teledyne LeCroy Signal Integrity Academy. Additionally, he is an Adjunct Professor at the University of Colorado-Boulder in the ECEE Dept. Eric improves the signal to noise ratio by sorting through all the information available and finding the best quality content to publish on Signal Integrity Journal.

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