Signal Integrity Webinar Series

Title: New Connectors for High-Speed Applications

Date: May 15, 2017

Time: 8am PT/ 11am ET

Sponsored by: CST - Computer Simulation Technology

Presented by: Joseph C. (Jay) Diepenbrock, Independent Consultant

Abstract:

This presentation will discuss connectors intended for use in new high speed applications. It will summarize the types of high speed connectors, concentrating on new printed circuit board (PCB) and I/O (cable) connectors. Key attributes of high speed connectors will be discussed, including electrical, mechanical, materials, and other considerations to be taken into account when selecting a connector. An overview of the characteristics of a number of connectors from various manufacturers will be presented, primarily using data from the manufacturers’ datasheets. Selected standards applicable to high speed connectors will also be mentioned, as well as tools and methods for evaluating and measuring connector performance. Key takeaways include key connector selection criteria, and knowledge of the high-level electrical performance and other attributes of various new high speed connectors.

Presenter Bio:

Joseph C. (Jay) Diepenbrock holds a Sc. B. (EE) from Brown University and an MSEE from Syracuse University. He worked in a number of development areas in IBM including IC, analog and RF circuit, and backplane design. He then moved to IBM’s Integrated Supply Chain, working on the electrical specification, testing, and modeling of connectors and cables and was IBM’s Subject Matter Expert on high speed cables. After a long career at IBM he left there and joined Lorom America as Senior Vice President, High Speed Engineering, and led the Lorom Signal Integrity team, supporting its high speed product development. He left Lorom in 2015, and now an independent consultant. Mr. Diepenbrock has authored or co-authored a number of technical papers, and contributed to a number of industry standards, is a Senior Member of the IEEE, and holds 12 patents.