Signal Integrity Journal Webinar Series

Title: Mechanical Considerations for Compression Mount RF Connectors: Swapping Out Solder for Screws

Date: May 10, 2023

Time: 8am PT / 11am ET

Sponsored by: Samtec

Presented by: Michael Griesi, RF Design & Simulation Engineering Manager, Zak Speraw, RF Design Engineer, Edwin Loy, Senior OptoMechanical Design Engineer, and Sage Wronowski, RF Design Engineer

Abstract:
Compression mount connectors have become popular to overcome solder variation when populating mmWave RF interconnects. While they successfully overcome solder variability, new considerations are introduced that could reduce the performance at high frequencies. This webinar explores the potential impact of board compression and pin alignment, and how to overcome.

Presenter Bios:
Michael Griesi received his B.Sc. and M.Sc. in Electrical Engineering focused on signal integrity from the University of South Carolina and has 20 years of experience across a broad background in electromagnetics spanning design, simulation, validation, and automation in digital high speed, wireless, and passive RF applications.

Zak Speraw received his B.Sc. in Electrical Engineering with a focus on signal integrity and has industry experience in the design, optimization, and measurement of high-speed digital and RF interconnects, as well as high-speed PCB breakouts.

Edwin Loy received his B.Sc. in Mechanical Engineering at the University of California, Berkeley and has 25 years of experience in mechanical design, packaging, and process development of optoelectronic components, with a passion for first principles design methods using simulation and measurement for experimentation and validation.

Sage Wronowski received his B.Sc. in Physics from West Chester University of Pennsylvania. Sage has 5 years of experience with RF Interconnects. Areas of expertise include modeling, design, testing, and simulation of RF interconnects.